A kind of preparation method of si-al electronic packaging material
An electronic packaging material, si-al technology, applied in the field of alloys, can solve the problems of complex production process, low tensile strength, coarse structure, etc., and achieve the effects of simple preparation process, improved billet performance, and easy operation.
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Embodiment 1
[0027] Weigh 30kg of pure silicon and 70kg of pure aluminum respectively, put the pure aluminum into the bottom of the intermediate frequency furnace, put silicon into the top, and heat with electricity until the aluminum and silicon are all melted into a melt, and the temperature of the melt is raised to 1000°C, and fully stirred , power off and stand still to cool down to 900°C, add 0.6% by weight of Zr-containing modifier; 2 Cl 6 Degassing and refining the silicon-aluminum melt with the refining agent Hongguang Refining Agent HGJ-1A purchased on the market, after which the slag is removed from the melt; the melt is heated to 1000°C and poured into the diversion tank for spray deposition process, the atomization pressure is 0.6-0.8MPa, the atomization temperature is 1000°C-1500°C, the atomization gas is nitrogen, and the deposition distance is 680-710mm. 30% of the ratio is sent to the spray deposition chamber and mixed with atomized droplets for deposition, thereby produci...
Embodiment 2
[0031] Weigh 50kg of pure silicon and 50kg of pure aluminum respectively, and complete the melt treatment according to the steps of Example 1, wherein the temperature of adding the modifier is 1100°C, and the temperature of the melt during the spray deposition process is 1300°C, and the added powder components It is 50Si50Al, and other parameters are unchanged, which is similar and consistent with the implementation example 1. Finally, a 50Si50Al ingot is obtained; ℃ and 100MPa, heat preservation and pressure for 2 hours, then cool with the furnace, take samples for tissue analysis and physical performance testing.
[0032] Spray deposited 50Si50Al alloy adopts the microstructure after hot isostatic pressing after the process of the present invention such as image 3 As shown, it can be seen from the figure that after the process of the present invention is adopted, the structure of the alloy is dense and uniform, there are no defects such as micropores, and there is no primar...
Embodiment 3
[0035]Weigh 75kg of pure silicon and 25kg of pure aluminum respectively, and complete the melt treatment according to the steps of Example 1, wherein the temperature of adding the modifier is 1350°C, and the temperature of the melt during the spray deposition process is 1450°C. 65Si35Al powder is added in the process, and other parameters are unchanged, which is similar to the implementation example 1, and the 70Si30Al billet is finally obtained; after taking the deposited sample, the billet is subjected to hot isostatic pressing process, and the temperature and pressure of hot isostatic pressing 530°C and 130MPa, respectively, heat preservation and pressure for 2 hours, then cool with the furnace, and take samples for tissue analysis and physical performance testing.
[0036] Microstructure of spray deposited 70Si30Al alloy after hot isostatic pressing Figure 4 shown. It can be seen from the figure that after the modification and hot isostatic pressing of the 70Si30Al alloy...
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Abstract
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