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Resin sheet and semiconductor device

A resin sheet and semiconductor technology, applied in the direction of semiconductor devices, semiconductor/solid-state device parts, epoxy resin glue, etc., can solve the problem of low storage stability, and achieve the effect of good quality and excellent operability

Active Publication Date: 2022-03-01
LINTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In addition, since the above-mentioned resin sheet usually contains a thermosetting resin such as an epoxy resin or a curing accelerator in the resin composition layer, the storage stability tends to be lowered, so refrigeration storage is sometimes necessary.

Method used

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  • Resin sheet and semiconductor device
  • Resin sheet and semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0106] Bisphenol A type phenoxy resin (manufactured by Mitsubishi Chemical Corporation, product name "jER1256") 5.1 parts by mass (solid content conversion, the same below) as a thermoplastic resin, bisphenol A type epoxy resin as a thermosetting resin (manufactured by Mitsubishi Chemical Corporation, product name "jER828") 5.7 parts by mass, biphenyl type epoxy resin (manufactured by Nippon Kayaku Co., Ltd., product name "NC-3000-L") as a thermosetting resin 5.7 parts by mass Parts, 4.1 parts by mass of naphthalene-type epoxy resin (manufactured by DIC CORPORATION, product name "HP-4700") as a thermosetting resin, biphenyl-type phenol as a thermosetting resin (manufactured by MEIWA PLASTIC INDUSTRIES, LTD., product Name "MEHC-7851-SS") 14.1 parts by mass, 2-ethyl-4-methylimidazole (manufactured by SHIKOKU CHEMICALS CORPORATION., product name "2E4MZ", melting point about 40°C) as an imidazole curing catalyst 0.1 parts by mass , Epoxysilane-treated silica filler as inorganic fi...

Embodiment 2～4

[0112] A resin sheet was obtained in the same manner as in Example 1 except that the drying conditions of the above-mentioned coating film were changed as shown in Table 1.

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Abstract

The present invention provides a resin sheet that does not easily float at the interface between a resin composition layer and a support sheet and that is excellent in handleability during processing and transport. The resin sheet (1) provided by the present invention is used for the sealing of electronic components or the formation of an insulating film in the manufacturing method of a semiconductor device using panel level packaging. The resin sheet (1) is equipped with a first support sheet (11), a resin combination The material layer (10) and the second support sheet (12), the resin composition layer (10) is formed by a resin composition containing a thermosetting resin, a thermoplastic resin below 30% by mass, and an inorganic particle above 50% by mass, The contact surface of the first support sheet (11) and the resin composition layer (10) is not peeled off using a silicone-based release agent, measured by gas chromatography mass spectrometry, and the resin composition layer (10) is heated at 120 ° C. The concentration of the volatile components produced when heated for 30 minutes is 100-45000ppm.

Description

technical field [0001] The present invention relates to a resin sheet and a semiconductor device manufactured using the resin sheet. Background technique [0002] In recent years, there has been a very high demand for miniaturization and thinning of semiconductor packages. In order to meet such demands, a fan-out semiconductor package has been proposed. As a method of manufacturing fan-out semiconductor packages, panel-level fan-out packaging technology (FOPLP), which is manufactured with a square substrate size of about 300 to 700 mm, has attracted attention. [0003] In the method of manufacturing a semiconductor device of FOPLP, for example, after laminating a sheet-shaped resin composition layer on an electronic component provided on a support, the electronic component is embedded in the resin composition by pressing the resin composition layer. layer. Then, the electronic component is sealed by curing the resin composition layer, and then, a rewiring layer is formed....

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/10C09J7/30C09J163/00C09J171/12C09J11/04H01L23/29
CPCH01L23/295C09J7/10C09J7/30C09J11/04C09J163/00C08L2203/206C08L2205/035C08L2205/025C09J2203/326C09J2471/00C09J2463/00C09J2301/408C08L71/12C08L63/00C08K9/06C08K3/36B32B27/20B32B27/08H01L23/293H01L23/291B32B2457/12
Inventor 根津裕介渡边康贵杉野贵志
Owner LINTEC CORP