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Low-silver back electrode slurry for chip resistors and preparation method for low-silver back electrode slurry

A technology of silver back electrode and slurry, which is applied in the manufacture of resistors, conductive materials dispersed in non-conductive inorganic materials, cables/conductors, etc., can solve the problems of high production costs, achieve no overflow, good continuity, The effect of good printability

Inactive Publication Date: 2019-03-26
西安宏星电子浆料科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a low-silver back electrode paste for chip resistors and a preparation method thereof. The performance indexes of this paste remain unchanged under the condition of low silver content, which can effectively solve the problems in the prior art. The problem of high production cost caused by advanced production technology

Method used

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  • Low-silver back electrode slurry for chip resistors and preparation method for low-silver back electrode slurry
  • Low-silver back electrode slurry for chip resistors and preparation method for low-silver back electrode slurry
  • Low-silver back electrode slurry for chip resistors and preparation method for low-silver back electrode slurry

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preparation example Construction

[0031] A preparation method of low-silver back electrode paste for chip resistors, comprising the following steps:

[0032] Step 1: Preliminarily mix the silver powder, metal oxide, glass powder, modifier, and part of the organic carrier through a mixer, and then homogenize the initial mixture through a three-roll mill until all the powders are well dispersed to make a slurry semi-finished products;

[0033] Step 2: the semi-finished slurry obtained in step 1 and the remaining organic carrier are stirred for a second time by a mixer; then the paste after the second stirring is subjected to low-pressure rolling by a three-roll mill to make it fully dispersed;

[0034] Step 3: Aging of the slurry to improve the consistency of the slurry performance: the slurry is stored under stirring for 60-120 hours at a temperature of 40-60 °C, and after the temperature is lowered to room temperature, it is then sieved through a 250-mesh sieve and vacuumized. Defoaming is made into finished ...

example 1

[0053] Step 1: 40 parts by mass of Ag powder (E), 3 parts by mass of nickelous oxide, 7 parts by mass of glass powder (including 5 parts by mass of glass powder 1 and 2 parts by mass of glass powder 2), 1 part by mass of DISPARLON, 19 parts by mass of glass powder Mass parts of the organic carrier are preliminarily mixed by a mixer, and then the initial mixture is homogenized by a three-roll mill until all the powders are well dispersed, and a semi-finished slurry is prepared;

[0054] Step 2: The semi-finished slurry obtained in step 1 and the remaining 30 parts by mass of the organic carrier are subjected to secondary stirring by a mixer, and then the paste after secondary stirring is subjected to low-pressure rolling by a three-roll mill to make it fully dispersed;

[0055] Step 3: The slurry was stirred and stored for 96 hours at 40°C, and after the temperature was lowered to room temperature, it was sieved through a 250-mesh sieve and vacuum defoamed to prepare Example Sam...

example 2

[0057] Step 1: 40 parts by mass of Ag powder (20 parts by mass of Ag powder (B), 20 parts by mass of Ag powder (E)), 3 parts by mass of nickelous oxide, and 7 parts by mass of glass powder (including 5 parts by mass of glass powder 1 and 2 parts by mass of glass frit 2), 1 part by mass of DISPARLON, and 19 parts by mass of organic carrier are preliminarily mixed by a mixer, and then, the initial mixture is homogenized by a three-roll mill until all powders are well dispersed to make a slurry semi-finished products;

[0058] Step 2: The semi-finished slurry obtained in step 1 and the remaining 30 parts by mass of the organic carrier are subjected to secondary stirring by a mixer, and then the paste after secondary stirring is subjected to low-pressure rolling by a three-roll mill to make it fully dispersed;

[0059] Step 3: The slurry was stored under stirring for 96 hours at 40°C, and after the temperature was lowered to room temperature, it was sieved through a 250-mesh sieve...

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Abstract

The invention discloses a low-silver back electrode slurry for chip resistors and a preparation method for low-silver back electrode slurry. The preparing method includes the steps of preliminarily mixing ultrafine silver powder, metal oxide, the glass powder modifier and partial organic carriers by a mixer; homogenizing the primary mixture by a three-roll mill until all the powders are well dispersed to form a slurry semi-finished product; secondarily mixing the slurry semi-finished product and the remaining organic carriers by the mixer; subjecting the paste to low-pressure rolling through athree-roll mill to be sufficiently dispersed, and then sieving through a 250-mesh sieve and carrying out vacuum defoaming to prepare a finished slurry. The back electrode slurry solves the problems of high resistance of a slurry sintered film and low adhesion to the alumina substrate under the condition of low silver content, and the production cost of a chip resistor product is reduced.

Description

technical field [0001] The invention relates to the technical field of conductive pastes, in particular to a back electrode paste for chip resistors and a preparation method thereof. Background technique [0002] At present, the rapid development of electronic information technology has constantly put forward new requirements for component technology, especially the technology of chip resistors has also been completely developed, which has pushed chip resistors into a period of rapid upgrading. As far as the development direction of chip resistors is concerned, there are mainly the following: ultra-miniaturization, green environmental protection, high precision, low temperature coefficient and base metalization. The development of chip components is also changing with each passing day, and chip components are also the mainstream and direction of the development of electronic components. Among them, the demand for chip resistors is the largest. The global annual demand for ...

Claims

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Application Information

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IPC IPC(8): H01B1/16H01B1/22H01B13/00H01C7/00
Inventor 肖雄陆冬梅吴高鹏梅元徐小艳王要东王大林孙社稷殷美刘丝颖张亚鹏李艳
Owner 西安宏星电子浆料科技股份有限公司
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