Preparation method of solid electrolytic capacitor

Abstract

A method for preparing a solid electrolytic capacitor, comprising: dividing a valve metal foil into an anode area and a cathode area by using an insulating glue; forming a cathode in the cathode area to become a basic core; The basic core is placed on the lead frame to become a capacitor core package fixed on the lead frame; the capacitor core package is packaged with insulating resin, and after the package is completed, the insulating resin is cured to form a capacitor assembly; The capacitor assembly on the lead frame is punched to form a single capacitor; and the single capacitor is aged. The preparation method improves aging effect, reduces leakage current, and improves product reliability.

Description

technical field [0001] The invention relates to the field of capacitor manufacturing, in particular to a method for preparing a solid electrolytic capacitor. Background technique [0002] An electrolytic capacitor refers to a capacitor formed by forming a dielectric layer on the surface of valve metals such as aluminum, tantalum, niobium, titanium, etc., for example, using an anodic oxidation method to generate a thin oxide layer as the dielectric layer, and using the electrolyte as the cathode. The capacitor is divided according to the state of the electrolyte Liquid electrolytic capacitors and solid electrolytic capacitors. At present, the development of electronic products tends to be miniaturized, and traditional liquid electrolytic capacitors are too large to meet the needs of large-scale and highly integrated IC markets. [0003] Among solid electrolytic capacitors, chip-type solid electrolytic capacitors with conductive polymers as cathodes have many advantages, such...

AI Technical Summary

Problems solved by technology

[0005] However, in the preparation process of the existing solid electrolytic capacitor, various processes cause the product to be impacted by mechanical stress and thermal stress, resulting in an increase in leakage current

However, the existing aging process is not effective in repairing the dielectric layer, resulting in a low pass rate of product leakage and poor product reliability. After surface mounting, some products may even fail in a short circuit.

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