Method and device for laser processing chip

Abstract

The invention provides a method and a device for laser processing of chips. The method comprises the following steps: a laser processing system is built by a laser and an optical element; position information of a refrigeration infrared detecting chip placing worktable is obtained; processing parameters of the laser processing system are set according to the position information, and laser processing light beams are generated by the laser processing system according to the processing parameters; the laser processing light beams with first power are used for processing light sensing layers of refrigeration infrared detector chips to form two parallel grooves; and then, the laser processing light beams with second power are used for processing epoxy glue in the refrigeration infrared detector chips between the two parallel grooves, so that closed annular grooves are formed between pixel layers on the refrigeration infrared detecting chips and the edges. The method can improve the groovestructures of prepared grooves, effectively controls heat effect areas on the grooves in the laser processing process, further optimizes the performances of the refrigeration infrared detecting chips,and improves the preparation yield.

Description

technical field [0001] The invention relates to the technical field of laser micromachining, in particular to a method and device for laser machining chips. Background technique [0002] Infrared detectors have been well used in both civil and military applications, and the performance of cooled infrared detectors is particularly excellent. The infrared detection chip in the cooling type infrared detector is often in an environment with drastic temperature changes. In order to ensure its normal working performance, the infrared detection chip in the detector needs to be cooled with liquid nitrogen during the working state. The temperature at this time is about It is -200°C, but during non-working hours, the infrared detection chip is exposed to the atmospheric temperature. For example, the highest temperature in the desert can sometimes reach about 70°C, so the ambient temperature of the infrared detection chip is between -200°C and Constantly changing between 70°C. [000...

AI Technical Summary

Problems solved by technology

The advantages of this method: simple operation, low equipment requirements, and good etching selectivity; disadvantages: first, a photolithography process is required for each chip, which is time-consuming and laborious; Liquid, complex corrosion process, low precision, easy to damage the bottom readout circuit

The advantages of dry etching: the first etching selectivity and anisotropy are good, the second etching pattern can be precisely controlled and the resolution is high; the disadvantages: first, a single chip needs to be photolithography, which is time-consuming and laborious, and the second is damage Bottom readout circuit

[0007] At the same time, laser cutting with a single laser processing beam cannot obtain a groove bottom structure with high flatness

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