Device and method for laser processing chip

Abstract

The invention provides a device and method for laser processing chips. The device includes: a workbench for placing a cooling infrared detection chip to be processed; a dust removal device arranged between the laser processing system and the workbench and on the A processing chamber is established above, which is used to feed auxiliary gas into the processing chamber so that the processing chamber is in a low-pressure state and use the pressure difference between the processing chamber and the atmospheric pressure to suck out the generated dust; The control system is used to set the processing parameters of the laser processing system according to the position information; the laser processing system is used to change the relative position of the laser processing beam and the cooled infrared detection chip through the vibrating mirror, so that the A closed annular groove is formed between the pixel layer and the edge. The present invention can remove impurities in the tank or at the edge of the tank by means of air blowing and negative pressure adsorption, effectively reducing the accumulation of impurities on the chip, reducing subsequent cleaning steps, and reducing cleaning difficulty.

Description

technical field [0001] The invention relates to the technical field of laser micromachining, in particular to a device and method for laser processing chips. Background technique [0002] Infrared detectors have been well used in both civil and military applications, and the performance of cooled infrared detectors is particularly excellent. The infrared detection chip in the cooling type infrared detector is often in an environment with drastic temperature changes. In order to ensure its normal working performance, the infrared detection chip in the detector needs to be cooled with liquid nitrogen during the working state. The temperature at this time is about It is -200°C, but during non-working hours, the infrared detection chip is exposed to the atmospheric temperature. For example, the highest temperature in the desert can sometimes reach about 70°C, so the ambient temperature of the infrared detection chip is between -200°C and Constantly changing between 70°C. [00...

AI Technical Summary

Problems solved by technology

The advantages of this method: simple operation, low equipment requirements, and good etching selectivity; disadvantages: first, a photolithography process is required for each chip, which is time-consuming and laborious; Liquid, complex corrosion process, low precision, easy to damage the bottom readout circuit

The advantages of dry etching: the first etching selectivity and anisotropy are good, the second etching pattern can be precisely controlled and the resolution is high; the disadvantages: first, a single chip needs to be photolithography, which is time-consuming and laborious, and the second is damage Bottom readout circuit

[0007] At the same time, because the cutting of infrared semiconductor materials by ultrashort pulse laser is mainly realized by multiphoton absorption mechanism, the process of plasma recombination is often accompanied by the generation of dust and smoke.

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