PI matrix resin and flame-retardant colorless transparent polyimide film prepared from same

A technology of transparent polyimide and matrix resin, applied in the field of flame-retardant colorless transparent polyimide film, can solve the problems of loss of film transparency, and achieve high glass transition temperature, excellent heat resistance stability, The effect of high transparency

Active Publication Date: 2019-04-05
CHINA UNIV OF GEOSCIENCES (BEIJING)
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, although the above method solves the flame retardancy of the polyimide film well, it loses the transparency of the film, which still limits the application of the PI film in the field of optoelectronic display devices to a large extent.

Method used

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  • PI matrix resin and flame-retardant colorless transparent polyimide film prepared from same
  • PI matrix resin and flame-retardant colorless transparent polyimide film prepared from same
  • PI matrix resin and flame-retardant colorless transparent polyimide film prepared from same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0063] The PI matrix resin described in this example is prepared by reacting CHDA, an alicyclic dianhydride monomer, and ODA, an aromatic diamine monomer. The specific preparation process includes:

[0064] Add 20.2040g (0.1mol) ODA and 150g NMP into a 500mL three-neck flask equipped with a heating mantle, mechanical stirring, thermometer, water separator, and reflux condenser; feed nitrogen gas and mechanically stir for 20 minutes to obtain a clear solution; stir Add 22.4170g (0.1mol) CHDA at the same time, the viscosity of the system gradually increases; at the same time, add 20g NMP, stir at room temperature for 30min, to obtain a viscous solution; When the temperature rises to 130-140°C, the toluene / water azeotrope evaporates from the water separator; maintain reflux for dehydration until no water drops come out of the system; continue to heat up to 180°C, keep the temperature for 3 hours, stop heating, and naturally cool to room temperature ; Slowly pour the viscous liqui...

Embodiment 2

[0070] The PI matrix resin described in this example is prepared by reacting CHDA, an alicyclic dianhydride monomer, and ODA, an aromatic diamine monomer. The specific preparation process is the same as in Example 1.

[0071] The flame-retardant colorless and transparent polyimide film described in this embodiment is prepared by the PI base resin prepared above in conjunction with a flame retardant FR (FR mass accounts for 10wt% of the total mass of the PI film, mass ratio), and the specific preparation process includes:

[0072] Take 10g of the above PI resin and dissolve it in 40g DMAc to obtain a PI solution; at the same time, dissolve 1.1111g FR (POPZ:TSP-POSS=95:5, mass ratio) in 4.4444g DMAc and pour it into the resin solution to prepare 20wt % PI composite solution; after the solution is mixed evenly, it is evenly coated on the surface of a clean glass plate by an automatic film coating machine, placed in a 100-class clean program temperature-controlled drying oven, and ...

Embodiment 3

[0105] The PI matrix resin described in this example is prepared by reacting the alicyclic dianhydride monomer HBPDA and the aromatic diamine monomer ODA, and the specific preparation process is the same as in Example 1.

[0106] The flame-retardant colorless transparent polyimide film described in this example is prepared from the PI matrix resin prepared above together with a flame retardant FR (POPZ:TSP-POSS=95:5, mass ratio) (the mass of FR accounts for the total amount of PI film 10wt% of mass, mass ratio).

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Abstract

The invention belongs to the technical field of polymer materials, and particularly relates to a colorless transparent PI matrix resin, and further discloses a preparation method of the colorless transparent PI matrix resin as well as a flame-retardant colorless transparent polymide film prepared from the PI matrix resin. The flame-retardant colorless transparent polyimide film is prepared by adopting the prepared PI matrix resin as a matrix raw material and adding selected flame-retardant agent FR filler (POPZ+TSP-POSS) without changing the transparency of the resin film is excellent in heatresisting stability, high in glass transition temperature (Tg), high in transparency and excellent in flame-retardant properties, thereby achieving a flame-retardant purpose. The flame-retardant colorless transparent polyimide film prepared in the invention can be used as a flexible material to be applied to the technical fields such as solar panels, flexible printed circuit boards, microelectrons, cars and the like, and is wide in application prospect.

Description

technical field [0001] The invention belongs to the technical field of polymer materials, and specifically relates to a colorless and transparent PI matrix resin, and further discloses a preparation method thereof, and a flame-retardant colorless and transparent polyimide film prepared from the PI matrix resin. Background technique [0002] Polyimide refers to a class of polymers containing imide rings (-CO-NH-CO-) on the main chain, among which polymers containing phthalimide structures are the most important. Polyimide is one of the organic polymer materials with the best comprehensive performance. It has the advantages of high temperature resistance, low dielectric constant, and corrosion resistance. Its high temperature resistance can reach above 400 ° C, and the long-term use temperature range is -200 ~ 300 ° C , has high insulating properties. As a special engineering material, polyimide has been widely used in aviation, aerospace, microelectronics, nanometer, liquid ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08L79/08C08L85/02C08L83/04C08J5/18
CPCC08G73/1007C08G73/1039C08G73/1046C08G73/105C08G73/1078C08J5/18C08J2379/08C08J2483/04C08J2485/02
Inventor 刘金刚武晓高艳爽皇甫梦鸽张燕姜岗岚郭晨雨
Owner CHINA UNIV OF GEOSCIENCES (BEIJING)
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