Ultra-hard laser crystal surface roughness machining method
A technology of surface roughness and laser crystal, which is applied in the field of laser crystal cold processing, can solve problems such as subsurface defects, difficult to remove, and difficult processing and manufacturing, and achieve the effect of improving surface roughness
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Embodiment 1
[0018] A method for processing the surface roughness of a superhard laser crystal. The processing object of this embodiment is a Nd:YAG slab crystal with a specification of 128mm×6mm×6mm, and the surface roughness of 128mm×6mm is required to be less than 0.3nm. The method includes the following steps:
[0019] 1) Detect the particle size of four specifications of silicon carbide for grinding, record the maximum particle size of 180# / 240# / 320# / 500# silicon carbide, the maximum particle size of 180# silicon carbide is 100μm, and the maximum particle size of 240# silicon carbide is 70μm , 320# silicon carbide maximum particle size 50μm, 500# silicon carbide particle size 25μm;
[0020] 2) Use a single-axis machine to grind the crystal element, use 180# silicon carbide to remove 1mm, use 240# silicon carbide to remove 0.3mm, use 320# silicon carbide to remove 0.2mm, use 500# silicon carbide to remove 0.15mm , Ultrasonic cleaning, using a stylus profiler to detect the surface of th...
Embodiment 2
[0024] A method for processing the surface roughness of a superhard laser crystal. The processing object of this embodiment is a Nd:YAG slab crystal with a specification of 133mm×33mm×3mm, and the large surface roughness of 133mm×33mm is required to be less than 0.3nm. The method includes the following steps :
[0025] 1) Detect the particle size of four specifications of boron carbide for grinding, record the maximum particle size of 180# / 240# / 320# / 500# boron carbide, the maximum particle size of 180# boron carbide is 80μm, and the maximum particle size of 240# boron carbide is 63μm , 320# boron carbide maximum particle size 45μm, 500# boron carbide particle size 20μm;
[0026] 2) Use a single-axis machine to grind the crystal element, use 180# boron carbide to remove 2mm, use 240# boron carbide to remove 0.3mm, use 320# boron carbide to remove 0.2mm, use 500# boron carbide to remove 0.15mm , Ultrasonic cleaning, using a stylus profiler to detect the surface of the component...
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