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Preparation process of low melting point composite material reinforced by carbon-based nanometer material

A technology of carbon-based nanomaterials and composite materials, applied in the field of preparation of carbon-based nanomaterials reinforced low-melting point composite materials, to achieve the effects of improving tensile strength, improving wettability, and rapid atomic diffusion

Active Publication Date: 2019-04-12
HENAN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Compared with the application of such high-temperature materials as high-temperature superconductors, there are few reports on the preparation of low-melting point materials, especially carbon-based nanomaterials reinforced low-melting point composites, by powder melting method.

Method used

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  • Preparation process of low melting point composite material reinforced by carbon-based nanometer material
  • Preparation process of low melting point composite material reinforced by carbon-based nanometer material
  • Preparation process of low melting point composite material reinforced by carbon-based nanometer material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] Step 1. Ball milling treatment: take 500mg of rGO and place it in a planetary ball mill for ball milling treatment. The mass of the balls is 25g, the speed is set at 500r / min, and the milling time is 3h.

[0037] Step 2, take rGO400mg of ball milling 3h, take Ni(CH 3 COO) 2 4H 2 O powder 830mg, uniformly mixed in a planetary ball mill, and the mixture was passed through N 2 Heating in an atmosphere tube furnace at 500°C for 2h with a gas flow rate of 900mL / min, cooling with the furnace to obtain Ni-rGO.

[0038]Step 3. Weigh 99.99g of Sn2.5Ag0.7Cu0.1RE solder powder with a particle size of 25-40μm; take a certain amount of Ni-rGO and ultrasonically treat it in alcohol solution for 30min, then mix it with Sn2.5Ag0.7Cu0.1RE The solder powder is mixed, and the mass fraction of Ni-rGO added is 0.01wt.%.

[0039] Step 4: Pour the mixture of Sn2.5Ag0.7Cu0.1RE solder powder and Ni-rGO in step 3 into a drum-type ball mill tank, set the rotation speed to 100r / min, and ball m...

Embodiment 2

[0042] Step 1. Ball milling treatment: take 500mg of rGO and place it in a planetary ball mill for ball milling treatment. The mass of the balls is 25g, the speed is set at 500r / min, and the milling time is 3h.

[0043] Step 2, take rGO400mg of ball milling 3h, take Ni(CH 3 COO) 2 4H 2 O powder 830mg, uniformly mixed in a planetary ball mill, and the mixture was passed through N 2 Heating in an atmosphere tube furnace at 500°C for 2h with a gas flow rate of 900mL / min, cooling with the furnace to obtain Ni-rGO.

[0044] Step 3. Weigh 99.99g of Sn2.5Ag0.7Cu0.1RE solder powder with a particle size of 25-40μm; take a certain amount of Ni-rGO and ultrasonically treat it in alcohol solution for 30min, then mix it with Sn2.5Ag0.7Cu0.1RE The solder powder is mixed, and the mass fraction of Ni-rGO added is 0.03wt.%.

[0045] Step 4: Pour the mixture of Sn2.5Ag0.7Cu0.1RE solder powder and Ni-rGO in step 3 into a drum-type ball mill tank, set the rotation speed to 100r / min, and ball ...

Embodiment 3

[0048] Step 1. Ball milling treatment: take 500mg of rGO and place it in a planetary ball mill for ball milling treatment. The mass of the balls is 25g, the speed is set at 500r / min, and the milling time is 3h.

[0049] Step 2, take rGO400mg of ball milling 3h, take Ni(CH 3 COO) 2 4H 2 O powder 830mg, uniformly mixed in a planetary ball mill, and the mixture was passed through N 2 Heating in an atmosphere tube furnace at 500°C for 2h with a gas flow rate of 900mL / min, cooling with the furnace to obtain Ni-rGO.

[0050] Step 3. Weigh 99.99g of Sn2.5Ag0.7Cu0.1RE solder powder with a particle size of 25-40μm; take a certain amount of Ni-rGO and ultrasonically treat it in alcohol solution for 30min, then mix it with Sn2.5Ag0.7Cu0.1RE The solder powder is mixed, and the mass fraction of Ni-rGO added is 0.05wt.%.

[0051] Step 4: Pour the mixture of Sn2.5Ag0.7Cu0.1RE solder powder and Ni-rGO in step 3 into a drum-type ball mill tank, set the rotation speed to 100r / min, and ball ...

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Abstract

The invention provides a preparation process of a low melting point composite material reinforced by a carbon-based nanometer material, and relates to a method of preparing a SnAgCu series high strength and tough composite solder reinforced by nickel particle modified reduced graphene oxide through a powder melting method, wherein a reinforced phase Ni-rGO is prepared by a ball-milling-thermal decomposition method. The preparation process includes the specific steps that rGO is placed in a planetary ball mill for ball-milling, the ball-milled rGO and Ni(CH3COO)2.4H2O powder are evenly mixed inproportion, and the mixture is heated in a tube furnace to form the Ni-rGO; the Ni-rGO is mixed with solder powder in proportion and then mixed in a drum type ball mill; and the mixed solder powder is loaded into a corundum crucible and heated in a muffle furnace, and the Ni-rGO reinforced composite solder is obtained after air cooling. According to the preparation process, the powder melting method is used for preparing the low melting point composite solder reinforced by the nickel nano particle modified reduced graphene oxide, and the strength of the material is improved.

Description

technical field [0001] The invention belongs to the field of composite material preparation, and in particular relates to a preparation process of a carbon-based nanomaterial reinforced low-melting point composite material. Background technique [0002] In the process of lead-free electronic packaging materials, SnAgCu-based solder is considered to be one of the best substitutes for lead-free solder due to its excellent mechanical strength and reliability. However, with the light weight, miniaturization and multi-functionalization of electronic products, the traditional SnAgCu solder can no longer meet the needs of current electronic products. Therefore, it is particularly important to develop a new type of high-strength and tough lead-free solder. [0003] The preparation of new lead-free solders by means of nanoparticle doping and microalloying, especially the preparation of nanoparticle-reinforced composite solders is an effective way to improve the performance of lead-f...

Claims

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Application Information

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IPC IPC(8): C22C13/00C22C1/05C22C1/10B23K35/40B23K35/02
CPCB23K35/0222B23K35/40C22C1/05C22C13/00
Inventor 张柯柯霍福鹏张萌王悔改马宁张超赵迪
Owner HENAN UNIV OF SCI & TECH
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