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Ultralimit copper alloy and preparation method thereof

A copper alloy, ultra-limit technology, applied in the field of ultra-limit copper alloy and its preparation, can solve the problem that copper alloy can not meet the use and other problems, achieve the effect of good bonding effect, reduce the probability of falling off, and increase the use time

Active Publication Date: 2019-04-12
KUNMING UNIV OF SCI & TECH
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Problems solved by technology

[0004] The present invention intends to provide an ultra-limit copper alloy and its preparation method to solve the problem that existing copper alloys cannot meet the requirements for use at ultra-limit temperatures

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  • Ultralimit copper alloy and preparation method thereof
  • Ultralimit copper alloy and preparation method thereof
  • Ultralimit copper alloy and preparation method thereof

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Embodiment Construction

[0043] The following is further described in detail through specific implementation methods:

[0044] The reference signs in the drawings of the description include: copper alloy substrate 1, bonding layer 2, precious metal layer 3, ceramic A layer 4, ceramic B layer 5, reflective layer 6, catadioptric layer 7, insulating layer 8, foamed carbon layer 9.

[0045] The invention provides an ultra-limit copper alloy, such as figure 1 As shown, including a copper alloy substrate 1, the surface of the copper alloy substrate 1 is sequentially deposited with a composite bonding layer with a thickness of 100-200 μm, a composite ceramic layer with a thickness of 150-500 μm, a reflective layer 6 with a thickness of 10-30 μm, and a thickness of A catadioptric layer 7 with a thickness of 10-30 μm, an insulating layer 8 with a thickness of 10-200 μm, and a carbon foam layer 9 with a thickness of 20-200 μm. Wherein the composite bonding layer is a bonding layer 2 deposited on the surface o...

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Abstract

The invention belongs to the technical field of copper alloy material preparation and discloses ultralimit copper alloy and a preparation method thereof. The ultralimit copper alloy comprises a copperalloy matrix, wherein a composite bonding layer, a composite ceramic layer, a reflecting layer, a catadioptric layer, an insulating layer and a foamy carbon layer are successively deposited on the surface of the copper alloy matrix; the composite bonding layer comprises a bonding layer deposited on the surface of the copper alloy matrix and a precious metal layer deposited on the surface of the bonding layer; and the composite ceramic layer comprises a ceramic A layer and a ceramic B layer. Through depositing multiple layers of coatings on the surface of the copper alloy matrix, the usage temperature of the ultralimit copper alloy is increased by 100-500 DEG C higher than a melting point of the original copper alloy matrix, so that the copper alloy can be used under an ultralimit environment. The ultralimit copper alloy is excellent in high temperature mechanical and chemical stability, can be used under the condition of exceeding the melting point of the copper alloy matrix and increases the using range.

Description

technical field [0001] The invention belongs to the technical field of preparation of copper alloy materials, and in particular relates to an ultra-limit copper alloy and a preparation method thereof. Background technique [0002] As an important metal material today, copper alloy refers to an alloy composed of copper as the matrix and added with other elements. Copper has good mechanical, physical and chemical properties, and copper alloys formed by adding suitable elements to copper have strong oxidation resistance, corrosion resistance, high temperature strength, and can improve certain physical properties, so copper alloys are widely used in energy Development, chemical industry, electronics, navigation, aviation and aerospace fields. Copper alloys play an irreplaceable role in the aerospace field due to their strong comprehensive properties such as strength, hardness, shock resistance, corrosion resistance, oxidation resistance, high temperature strength and certain ph...

Claims

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Application Information

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IPC IPC(8): C23C28/00C23C4/129C23C4/073C23C14/30C23C14/16C23C4/134C23C4/11C23C4/131C23C14/08B05D1/28B05D7/24
CPCC23C4/073C23C4/11C23C4/129C23C4/131C23C4/134C23C14/08C23C14/083C23C14/16C23C14/30C23C28/3215C23C28/3455B05D1/28B05D7/24B05D7/58
Inventor 冯晶吴福硕宋鹏种晓宇葛振华
Owner KUNMING UNIV OF SCI & TECH
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