A kind of thin-layer paving material suitable for wet road and bridge deck and preparation method thereof

A technology for paving materials and road and bridge decks, which is applied in the field of pavement pavement materials, can solve the problems of not being able to cure the wet base surface, poor flexibility, poor flexibility, etc., achieve good water boiling aging resistance, and reduce the traffic accident rate , little effect of traffic pressure

A technology for paving materials and road and bridge decks, which is applied in the field of pavement pavement materials, can solve the problems of not being able to cure the wet base surface, poor flexibility, poor flexibility, etc., achieve good water boiling aging resistance, and reduce the traffic accident rate , little effect of traffic pressure

CN109627686BActive Publication Date: 2021-05-14广东建科交通工程质量检测中心有限公司

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  • A kind of thin-layer paving material suitable for wet road and bridge deck and preparation method thereof
  • A kind of thin-layer paving material suitable for wet road and bridge deck and preparation method thereof
  • A kind of thin-layer paving material suitable for wet road and bridge deck and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] The thin-layer pavement material suitable for wet road and bridge decks provided in this embodiment includes epoxy resin binder and wear-resistant aggregate, wherein the epoxy resin binder includes A component and B component with a mass ratio of 1:0.5 Components, the specific dosage of each component is as follows:

[0050] Epoxy resin binder composition (mass parts):

[0051] A component:

[0052]

[0053] Wherein novolak epoxy resin DEN431 includes but not limited to available from Dow Chemical.

[0054] B component:

[0055] DMP-30 5

[0056] Phenalkamide Curing Agent 65

[0057] 4,4′-Diaminodiphenylmethane 30

[0058] The wear-resistant aggregate is ceramic aggregate, the Mohs hardness is greater than 7, and the dust content is less than 1wt%. The mass percentages of particles with different particle sizes are:

[0059] Particle size 1.18mm~2.36mm 5%

[0060] Particle size 2.36mm ~ 4.75mm 95%.

[0061] The preparation method of the thin-layer paving mate...

Embodiment 2

[0066] The thin-layer pavement material suitable for wet road and bridge decks provided in this embodiment includes epoxy resin binder and wear-resistant aggregate, wherein the epoxy resin binder includes A component and B component with a mass ratio of 1:0.65 Components, the specific dosage of each component is as follows:

[0067] Epoxy resin binder composition (mass parts):

[0068] A component:

[0069]

[0070] B component:

[0071] DMP-30 8

[0072] Phenalkamide Curing Agent 70

[0073] ZY1050 modified alicyclic amine 22

[0074] The wear-resistant aggregate is corundum, the Mohs hardness is greater than 7, and the dust content is less than 1wt%. The mass percentages of particles with different particle sizes are:

[0075] Particle size 1.18mm~2.36mm 35%

[0076] Particle size 2.36mm ~ 4.75mm 65%.

[0077] The preparation method of the thin-layer paving material suitable for wet road bridge decks is as follows:

[0078] (1) According to the above dosage relati...

Embodiment 3

[0082] The thin-layer pavement material suitable for wet road and bridge decks provided in this embodiment includes epoxy resin binder and wear-resistant aggregate, wherein the epoxy resin binder includes A component and B component with a mass ratio of 1:0.75 Components, the specific dosage of each component is as follows:

[0083] Epoxy resin binder composition (mass parts):

[0084] A component:

[0085]

[0086] B component:

[0087] DMP-30 6

[0088] Phenalkamide Curing Agent 80

[0089] ZY1050 modified cycloaliphatic amine 14

[0090] The ZY1050 modified alicyclic amine curing agent includes but is not limited to those purchased from Xuzhou Zhongyan Technology Industry Co., Ltd.

[0091] The wear-resistant aggregate is basalt, the Mohs hardness is greater than 7, and the dust content is less than 1wt%. The mass percentages of particles with different particle sizes are:

[0092] Particle size 1.18mm~2.36mm 20%

[0093] Particle size 2.36mm ~ 4.75mm 80%.

[009...

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Abstract

The invention discloses a thin-layer pavement material suitable for wet road and bridge decks, which includes epoxy resin cement and wear-resistant aggregate, wherein the epoxy resin cement includes a mass ratio of 1:(0.5~ 0.85) of component A and component B; the component A is mainly composed of the following raw materials in proportion by mass: epoxy resin: 60-80, toughening agent: 5-15, reactive diluent 10-30 , coupling agent 0.5-1.5; the B component is mainly composed of the following raw materials in proportion by mass: curing accelerator 5-8, curing agent 92-95. Also disclosed is a preparation method for the thin-layer pavement material suitable for wet road and bridge decks. The pavement material can be applied to wet road and bridge decks, has good skid resistance, wear resistance, outstanding interface bonding performance, waterproof, low water absorption, good boiling aging resistance, and good durability.

Description

technical field [0001] The invention belongs to pavement pavement materials, in particular to a thin-layer pavement material suitable for wet road and bridge decks and a preparation method thereof. Background technique [0002] Epoxy resin thin-layer pavement refers to the anti-skid and wear-resistant thin-layer pavement with a thickness of only 3-6mm formed by bonding epoxy resin adhesive as the bottom layer and wear-resistant aggregate. In foreign countries such as the United States, due to the relatively long development time of related industries and relatively mature technology, there are currently many products available, with good performance and durability, but the scale is small, and they have a high impact on the application base. It is required to ensure that the moisture content of the base surface is below 8%. At present, the research and development of epoxy thin-layer overlays in China is still in its infancy, and the experimental section of modified epoxy re...

Claims

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Application Information

Patent Timeline
14 May 2021
Publication
CN109627686B
IPC
C08L63/00; C08L75/04; C08L61/06; C08K3/013; C08K3/34
CPC
C08L63/00; C08L2201/08; C08L2205/025; C08L2205/03; C08L2205/04; C08L75/04; C08K3/013; C08K3/34
Inventors
韩亚芳; 吴迪