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Method for manufacturing preset gold-tin solder based on ceramic

A technology of gold-tin solder and its production method, which is applied in the direction of metal material coating process, welding/cutting medium/material, welding equipment, etc., can solve complex process, inaccurate control of gold-tin alloy ratio, single-layer thickness Poor control accuracy and other issues to achieve process stability, improve deposition stability, and good firmness

Pending Publication Date: 2019-04-16
苏州厚朴传感科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantages of this scheme are (1) poor thickness control accuracy: firstly, the uniformity of the overall substrate in the electroplating process is poor, about 10%; secondly, the control accuracy of single-layer thickness is poor, about 5%; The ratio of the gold-tin alloy that comes out cannot be precisely controlled, and the temperature and state of the alloy change greatly during subsequent packaging.
(2) The plating solution needs to be replaced for each layer of plating, the process is complicated and the process is easy to cause oxidation
[0006] 3. Gold-tin smelting. This process is mainly used in the production of gold-tin solder sheets. The thickness is more than 0.1 mm, which cannot be preset on ceramic substrates.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] A preparation method based on ceramics pre-prepared gold-tin solder preparation method, comprising the following steps:

[0027] S1. The ceramic substrate is pretreated, specifically, the ceramic substrate is treated with a temperature of 25°C and a concentration of 30%.

[0028] Soak in hydrochloric acid for 5 minutes. After soaking, take out the ceramic substrate, rinse the ceramic substrate with pure water, and then put the ceramic substrate into the ultrasonic cleaning line for cleaning and drying;

[0029] S2. Put the ceramic substrate into the fixture, and then put it into the evaporation coating equipment, and the vacuum degree reaches 2X10 （-2） PA, coating begins after the temperature reaches 200°C;

[0030] S3. Plating TI material at a speed of 30A / s to form a TI layer, the thickness of the TI layer is 200nm;

[0031] S4, plating Pt material at a speed of 25A / s to form a Pt layer, the thickness of the Pt layer is 200nm;

[0032] S5, Au material is plated at ...

Embodiment 2

[0043] A preparation method based on ceramics pre-prepared gold-tin solder preparation method, comprising the following steps:

[0044] S1. The ceramic substrate is pretreated, specifically, the ceramic substrate is treated with a temperature of 25°C and a concentration of 30%.

[0045] Soak in hydrochloric acid for 5 minutes. After soaking, take out the ceramic substrate, rinse the ceramic substrate with pure water, and then put the ceramic substrate into the ultrasonic cleaning line for cleaning and drying;

[0046] S2. Put the ceramic substrate into the fixture, and then put it into the evaporation coating equipment, and the vacuum degree reaches 2X10 （-2） PA, coating begins after the temperature reaches 200°C;

[0047] S2. Put the ceramic substrate into the fixture, and then put it into the evaporation coating equipment, and the vacuum degree reaches 2X10 （-2） PA, coating begins after the temperature reaches 200°C;

[0048] S3, plating TI material at a speed of 30A / s to...

Embodiment 3

[0059] A preparation method based on ceramics pre-prepared gold-tin solder preparation method, comprising the following steps:

[0060]S1. The ceramic substrate is pretreated, specifically, the ceramic substrate is treated with a temperature of 25°C and a concentration of 30%.

[0061] Soak in hydrochloric acid for 5 minutes. After soaking, take out the ceramic substrate, rinse the ceramic substrate with pure water, and then put the ceramic substrate into the ultrasonic cleaning line for cleaning and drying;

[0062] S2. Put the ceramic substrate into the fixture, and then put it into the evaporation coating equipment, and the vacuum degree reaches 2X10 （-2） PA, coating starts after the temperature reaches 200°C;

[0063] S2. Put the ceramic substrate into the fixture, and then put it into the evaporation coating equipment, and the vacuum degree reaches 2X10 （-2） PA, coating starts after the temperature reaches 200°C;

[0064] S3, plating TI material at a speed of 30A / s to ...

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Abstract

The invention provides a method for manufacturing preset gold-tin solder based on ceramic. The method comprises the following steps of S1 preprocessing a ceramic substrate; S2 putting the ceramic substrate into a tool clamp, then putting the ceramic substrate into an evaporation coating device, and carrying out vacuum coating; S3 coating to obtain a TI layer at the speed of 30A / s; S4 coating to obtain a Pt layer at the speed of 25A / s; S5 coating to obtain a Au layer at the speed of 30A / s; S6 coating to obtain a Sn layer at the speed of 25A / s; S7 coating to obtain a Au layer at the speed of 20A / s; S8 coating to obtain a Sn layer at the speed of 15A / s; S9 coating to obtain a Au layer at the speed of 30A / s; S10 coating to obtain a Sn layer at the speed of 25A / s; S11 coating to obtain a Au layer at the speed of 30A / s; S12 setting a cooling curve after the evaporation coating is completed. According to the method, a transition join layer is made of Ti and Pt, the deposition stability of theSn material during evaporation is improved, the firmness is good, the process is stable, and the method is suitable for industrialization.

Description

technical field [0001] The invention relates to the field of packaging of optoelectronic components, in particular to a preparation method of pre-prepared gold-tin solder based on ceramics. Background technique [0002] The gold-tin alloy with eutectic composition has attracted extensive attention of researchers due to its excellent mechanical properties and has been widely used in the fields of integrated circuit packaging cover plate, welding optoelectronic components and MEMS devices. Gold-tin alloy has a high gold content, about 80%, and a low degree of oxidation during soldering, so it can achieve flux-free soldering. This feature is especially important for optoelectronic device packaging, because optoelectronic component packaging must prevent components from being polluted to avoid contamination. Affecting its optical performance, gold-tin packaging solder has many advantages, such as: high yield strength, good thermal conductivity, suitable for high-power device pac...

Claims

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Application Information

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IPC IPC(8): C23C14/24C23C14/18C23C14/16B23K35/40
CPCB23K35/40C23C14/16C23C14/18C23C14/24
Inventor 周东平
Owner 苏州厚朴传感科技有限公司
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