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Method and device for powder magnetron sputtering coating

A magnetron sputtering coating and powder technology, which is applied in sputtering coating, ion implantation coating, vacuum evaporation coating, etc., can solve the problem of dust dispersion, failure to guarantee the uniformity of powder coating, damage to high vacuum system and Vacuum pump and other problems to achieve the effect of ensuring uniformity, ensuring effective control, and improving production efficiency

Inactive Publication Date: 2019-04-16
BEIJING UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Generally, the magnetron sputtering coating of powder adopts a material tray vibrating by a simple electromagnet, or uses a drum-type powder to roll in the material cylinder. When the powder is working, the powder vibrates or rolls up and down disorderly, which cannot guarantee the powder coating. uniformity, and it is easy to cause dust to diffuse into the vacuum pipeline and furnace chamber, which will damage the high vacuum system and vacuum pump

Method used

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  • Method and device for powder magnetron sputtering coating
  • Method and device for powder magnetron sputtering coating
  • Method and device for powder magnetron sputtering coating

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] Put the vibrating plate together with the shielding tube into the magnetron sputtering studio, fix the rubber feet of the base, connect the control and power lines, align the silver target with the center of the vibrating plate at a distance of 100mm, and then pour 200g of 100μm aluminum powder Pour it into the material tray of the vibrating tray, close the furnace door and turn on the vacuum pump to evacuate, and the vacuum degree in the vacuum chamber reaches 3.0×10 -3 ~2.0×10 -4 Pa, fill the vacuum chamber with high-purity argon gas, so that the working pressure in the vacuum chamber is 3.0Pa, turn on the vibration plate switch to adjust the frequency to 100Hz, then turn on the magnetron sputtering switch to adjust the power to 80W, and the time is 240min. First turn off the magnetron sputtering equipment in order, and then turn off the vibrating plate to get good silver-coated aluminum powder.

Embodiment 2

[0038] Put the vibrating plate together with the shielding tube into the magnetron sputtering studio, fix the base rubber feet, connect the control and power lines, align the silver target with the center of the vibrating plate at a distance of 100mm, and then pour 250g of 150μm glass powder Pour it into the material tray of the vibrating tray, close the furnace door and turn on the vacuum pump to evacuate, and the vacuum degree in the vacuum chamber reaches 3.0×10 -3 ~2.0×10 -4 Pa, fill the vacuum chamber with high-purity argon gas, so that the working pressure in the vacuum chamber is 3.0Pa, turn on the vibration plate switch to adjust the frequency to 100Hz, and then turn on the magnetron sputtering switch to adjust the power to 100W for 300min. After the sputtering is completed First turn off the magnetron sputtering equipment in order, and then turn off the vibrating plate, and then a good silver-coated glass powder can be obtained.

Embodiment 3

[0040] Put the vibrating plate together with the shielding tube into the magnetron sputtering studio, fix the rubber feet of the base, connect the control and power lines, align the copper target with the center distance of 100mm of the vibrating plate, and then put 150g of 80μm graphite powder Pour it into the material tray of the vibrating tray, close the furnace door and turn on the vacuum pump to evacuate, and the vacuum degree in the vacuum chamber reaches 3.0×10 -3 ~2.0×10 -4 Pa, fill the vacuum chamber with high-purity argon gas, so that the working pressure in the vacuum chamber is 3.0Pa, turn on the vibration plate switch to adjust the frequency to 100Hz, then turn on the magnetron sputtering switch to adjust the power to 50W, and the time is 400min. First turn off the magnetron sputtering equipment in order, and then turn off the vibrating plate, and then get good copper-clad graphite powder.

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Abstract

The invention discloses a method and a device for powder magnetron sputtering coating, and belongs to the field of high vacuum magnetron sputtering coating. The device comprises a vibrating disc, an electromagnet vibrating base, a powder flow dividing baffle plate, a baffle plate for preventing powder from flowing into a guide groove, an electromagnetic shielding protective metal cylinder, and aninsulating partition plate between a material disc and the vibrating base. A spiral track grooves is formed in the edge of the vibrating disc; a protruded groove edge achieves an effect on guiding thepowder; and the powder flow dividing baffle plate achieves an effect of dividing the flow of the powder so as to prevent the powder in the disc from overflowing from the material disc because of deposition caused by an overlarge steering angle. The uppermost part of the spiral track groove of the vibrating disc is connected with an downward inclined surface which directly leads to the centre of the material disc; and the width of the inclined surface is greater than the width of the groove, which can ensure that the powder which slides down by relying on the gravity does not deposit, so thatthe powder flows smoothly continuously. According to the method and the device for the powder magnetron sputtering coating, the coating uniformity and the production efficiency can be greatly improved, and effective control of repeatability of components of a thin film in a production process can be ensured by orderly arranging, rolling and performing sputtering coating circularly and reciprocallyby adopting a powder material.

Description

technical field [0001] The invention belongs to the field of high vacuum magnetron sputtering coating, in particular to a powder magnetron sputtering coating device and method. Background technique [0002] Magnetron sputtering is a type of physical vapor deposition. The general sputtering method can be used to prepare various materials such as metals, semiconductors, and insulators, and has the advantages of simple equipment, easy control, large coating area, and strong adhesion. Since the 1980s, magnetron sputtering technology has developed rapidly. The development of its application field has been greatly promoted. Now magnetron sputtering technology has occupied a pivotal position in the field of coating, and plays a great role in industrial production and scientific fields. It is the increasing demand for high-quality thin films in various aspects of the market recently that has led to the continuous development of magnetron sputtering. In many respects, magnetron sp...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/35C23C14/50
CPCC23C14/35C23C14/50
Inventor 王澈王群瞿志学唐章宏李永卿
Owner BEIJING UNIV OF TECH
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