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Photosensitive resin composition and preparation method thereof

A technology of photosensitive resin and composition, which is applied in the field of 3D printing materials, can solve the problems of insufficient performance, printing and molding, low conversion rate, etc., and achieve the effect of fast reaction speed, low viscosity and high reactivity

Active Publication Date: 2021-07-23
SUZHOU POLLY NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Compared with the traditional polymerization method, the reaction speed of photosensitive resin is extremely fast, the conversion rate is not high, and the molecular weight is low, while the molecular weight of liquid photocurable resin is too large, which will lead to high viscosity and cannot be printed. The size of the molecular weight determines to a certain extent The performance of the material makes the performance of the current 3D printed products less than the performance of the resin polymerized by the traditional process

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] A photosensitive resin composition, wherein the mass percentage of each component is: 22.5% of E51, 25% of 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexyl carboxylate, 10% of NANOCRYL ® C153, 10% Elvaloy4170, 5% Boltorn TM P500, 20% CN2302, 2.5% photoinitiator 184, 5% triarylsulfonium hexafluoroantimonate.

[0046] The method for preparing the photosensitive resin composition is: weigh 22.5 parts by weight of E51, 25 parts by weight of 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexyl formate, 10 parts by weight of NANOCRYL ® C153, 10 parts by weight of Elvaloy 4170, 5 parts by weight of Boltorn TM P500, 20 parts by weight of CN2302, 2.5 parts by weight of photoinitiator 184, 5 parts by weight of triarylsulfonium hexafluoroantimonate, stirred in a mixer with vacuum, stirring temperature 28 ° C, stirring speed 1500rpm , stirring for 3.5 hours to obtain the photosensitive resin composition.

Embodiment 2

[0048] Photosensitive resin composition, wherein the mass percentage of each component is divided into: 22.5% of E51, 25% of 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexyl carboxylate, 5% of NANOCRYL ® C153, 12% Elvaloy4170, 10% Boltorn TM P500, 18% CN2302, 2.5% photoinitiator 184, 5% triarylsulfonium hexafluoroantimonate.

[0049] The method for preparing the photosensitive resin composition is: weigh 22.5 parts by weight of E51, 25 parts by weight of 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexyl formate, 5 parts by weight of NANOCRYL ® C153, 12 parts by weight of Elvaloy4170, 10 parts by weight of Boltorn TM P500, 18 parts by weight of CN2302, photoinitiator 184 of 2.5 parts by weight, triarylsulfonium hexafluoroantimonate of 5 parts by weight, stirred in a mixer with vacuuming, stirring temperature 28 ° C, stirring speed 1000rpm , stirred for 4 hours to obtain the photosensitive resin composition.

Embodiment 3

[0051] Photosensitive resin composition, wherein the mass percentage of each component is divided into: 22% of E51, 15% of 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexyl carboxylate, 12% of NANOCRYL® C153, 10% Elvaloy 4170, 10% Boltorn TMP500, 25% CN2302, 2% photoinitiator 184, 4% triarylsulfonium hexafluoroantimonate.

[0052] The method for preparing the photosensitive resin composition is: weigh 22 parts by weight of E51, 15 parts by weight of 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexyl formate, 12 parts by weight of NANOCRYL ® C153, 10 parts by weight of Elvaloy 4170, 10 parts by weight of Boltorn TM P500, 25 parts by weight of CN2302, 2 parts by weight of photoinitiator 184, 4 parts by weight of triarylsulfonium hexafluoroantimonate, stirred in a mixer with vacuum, stirring temperature 28 ° C, stirring speed 2000rpm , stirring for 2 hours to obtain the photosensitive resin composition.

[0053] The following table 1 is embodiment 4-12, which according to the method of ...

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Abstract

The invention discloses a photosensitive resin composition and a preparation method thereof. The photosensitive resin composition is composed of the following raw materials: epoxy resin, nano silicon dioxide, modified resin, dendritic polyol, dendritic acrylate polymer , free radical photoinitiator, cationic photoinitiator, the photosensitive resin composition provided by the invention has high tensile strength and elongation, strong wear resistance, good strength and toughness, excellent thermal stability, heat resistance And the advantages of reaction speed, lower viscosity and higher reactivity, etc., make the photosensitive resin composition have faster reaction speed, higher initial strength, and can improve the printing speed of the photosensitive resin.

Description

technical field [0001] The invention relates to the technical field of 3D printing materials, in particular to a photosensitive resin composition for 3D printing and a preparation method thereof. Background technique [0002] 3D printing technology combines different disciplines such as materials, computers, machinery, and control. It is a method of building objects by accumulating different materials layer by layer based on 3D digital model files. Compared with traditional manufacturing technology, 3D printing does not need to make molds in advance, remove a large amount of material during the manufacturing process, and get the final product without going through complicated forging processes. Therefore, structural optimization, material saving and save energy. 3D printing technology is suitable for new product development, fast single-piece and small-batch parts manufacturing, complex-shaped parts manufacturing, mold design and manufacturing, etc., and is also suitable fo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L33/04C08K3/36C08G59/24B33Y70/10
CPCB33Y70/00C08G59/24C08K2201/011C08L33/04C08L63/00C08L2205/035C08K3/36
Inventor 王文斌
Owner SUZHOU POLLY NEW MATERIAL TECH CO LTD
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