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Preparation process of alkoxy side chain polyimide/nanometer silica hybrid

A technology of nano-silica and polyimide, which is applied in the field of preparation of alkoxy side-chain polyimide/nano-silica hybrid materials, can solve the problems of thermal stability decline and achieve thermal stability Reinforcement, reduction of thermal expansion coefficient, small particle size effect

Inactive Publication Date: 2008-05-21
SOUTHEAST UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Non-polar side chains are introduced into the main chain of polyimide, the surface tension decreases with the growth of alkoxy side chains, and its thermal stability in air also decreases

Method used

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  • Preparation process of alkoxy side chain polyimide/nanometer silica hybrid

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] with C 4 -PMDA / SiO2 2 As an example, take polyamic acid solution and a certain amount of silica sol and mix them evenly, spin-lay and imidize to make nano-SiO 2 material (thickness about 0.5mm). prepared under the same conditions without nano-SiO 2 materials compared when SiO 2 When the content is 2% (mass ratio): the maximum light transmittance decreases from 89% to 87%, the tensile strength at room temperature increases to 131.5%, the elongation at break increases from 20% to 33%, and the thermal decomposition temperature increases from 377°C increased to 395°C; when SiO 2 When the content is 4% (mass ratio): the maximum light transmittance decreases from 89% to 84%, the tensile strength at room temperature increases to 140%, the elongation at break increases from 20% to 39%, and the thermal decomposition temperature increases from 377°C increased to 425°C.

Embodiment 2

[0030] with C 12 -PMDA as an example, take polyamic acid solution and a certain amount of silica sol and mix evenly, spin laying, imidization to make nano-SiO 2 material (thickness about 0.5mm). prepared under the same conditions without nano-SiO 2 materials compared when SiO 2When the content is 2% (mass ratio): the maximum light transmittance decreases from 82% to 79%, the tensile strength at room temperature increases to 138.6%, the elongation at break increases from 26% to 41%, and the thermal decomposition temperature increases from 355.6°C increased to 385°C; when SiO 2 When the content is 4% (mass ratio): the maximum light transmittance decreases from 82% to 76%, the tensile strength at room temperature increases to 143%, the elongation at break increases from 26% to 43%, and the thermal decomposition temperature increases from 355.6°C increased to 402°C.

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Abstract

The preparation process of alkoxy side chain polyimide / nanometer silica hybrid material includes: dissolving 4'-butoxy phenyl-3, 5-diamino benzoate in N, N-dimethyl acetamide to compound solution through stirring; adding pyromellitic dianhydride in the same molar amount as that of 4'-butoxy phenyl-3, 5-diamino benzoate into the solution through stirring to obtain polyamic acid solution; adding silica sol to the solution to prepare mixed sol solution; and final vacuum drying to obtain the alkoxy side chain polyimide / nanometer silica hybrid material. The present invention has high heat stability, mechanical stability, high toughness and other advantages, and is used in specific technological field and for modifying other common polyimide.

Description

technical field [0001] The invention relates to a preparation method of a modified alkoxy side chain polyimide, and relates to a preparation method of an alkoxy side chain polyimide / nanometer silicon dioxide hybrid material. Background technique [0002] Aromatic polyimide (PI) is a class of polymers containing imide rings in the main chain, which has excellent dielectric properties, mechanical properties, thermal stability, oxidation stability, chemical resistance and radiation resistance , the range of application is very wide. In the past ten years, the application of polyimide in the fields of aerospace, electrical and electronics, locomotives, automobiles, precision machinery and automatic office machinery has developed rapidly. [0003] The general-purpose polyimide molecular chain is rigid and has a high glass transition temperature until it is insoluble and infusible at the decomposition temperature. It can only be formed in its prepolymer: polyamic acid stage, and ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L79/08C08K3/36
Inventor 孙岳明林保平王华林
Owner SOUTHEAST UNIV
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