Conductive adhesive

A technology of conductive adhesives and adhesives, applied in the field of adhesives and conductive adhesives, can solve the problems of electronic components without solving the bonding area, achieve enhanced bonding performance, expand the scope of use, and facilitate batches The effect of production

Inactive Publication Date: 2019-04-19
GUIZHOU ZHENHUA FENGGUANG SEMICON
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

None of these patented technologies solves the problem that the bonding area is less than 1×1mm 2 And higher than 0.3×0.3mm 2 problems with electronic components

Method used

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Examples

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Embodiment

[0023] Preparation of conductive adhesives for bonding copper to gold conductive tape. The size of the copper material is 0.5mm×0.5mm×0.25mm.

[0024] Diethylene glycol and cyanate resin are used as a mixed solvent system, and a uniform organic mixed solvent is formed by sufficient stirring, and the proportion of the two is 2:3; silver powder with a purity of 99.95% is selected, and the balls are milled into micro-nano scale through high-energy ball milling Silver powder, and then select sample sieves with different meshes to sort out the A-type silver particles with a diameter of 3-20 μm and the B-type silver particles with a diameter of 200 nm or less. Pour into the prepared mixed organic solvent; then add 2-cyclohexyl acrylate particles as a dispersant, the particle size is less than 20μm. Then a double planetary power mixer was used for mixing and infiltration, and finally the prepared conductive adhesive was placed in a -40°C refrigerator for storage for later use. In t...

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Abstract

The invention relates to a conductive adhesive. The conductive adhesive is prepared by: taking diethylene glycol and cyanate ester resin as the organic mixed solvent, incorporating silver powder A andB, then adding a dispersant and performing mixing. The silver powder A and B are obtained by: subjecting silver powder with purity of 99.95% to high-energy ball milling into micro-nanoscale silver powder, and then conducting sorting to obtain silver particles A with a diameter of 3-20microm and silver particles B with a diameter of less than or equal to 200nm. The conductive adhesive provided bythe invention has the advantages that: (1) diethylene glycol and cyanate ester resin are employed as the mixed solvent system to strengthen the bonding performance of thermoplastic resin, and endows small electronic components with sufficiently strong bonding force, thus expanding the application range; (2) the high content micro-nanoscale silver particles are cooperated with the similar three-dimensional chain-like path of the mixed solvent to enhance the high conductivity of the silver-based adhesive; (3) bonding as many electronic components as possible by one adhesive can be ensured in onepackaging chamber; and (4) the process is simple and is convenient for batch production. The conductive adhesive is suitable for bonding various integrated circuits.

Description

technical field [0001] The present invention relates to adhesives, and in particular, to conductive adhesives, especially conductive adhesives in integrated circuit packaging. Background technique [0002] As we all know, conductive adhesives belong to the category of functional adhesives. There are two main bonding methods for integrated circuit electronic components, one is alloy welding and the other is adhesive bonding. The two bonding methods cover most of the bonding methods of electronic components. [0003] Alloy welding is often used in the bonding of high-power electronic components because of its high electrical conductivity, high heat dissipation and high strength bonding properties. However, electronic components must be metallized on the back side to be bonded by alloy soldering; in addition, the size of electronic components will also limit the bonding effect. In the alloy soldering bonding of hybrid circuits and modules, the larger (size ) bonding effect i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J179/04C09J9/02C09J11/00
CPCC08K2003/0806C08K2201/003C08K2201/014C09J9/02C09J11/00C09J179/04C08K3/08
Inventor 张超超刘玉祥蔡景洋聂平健谌帅业李洪秀周恒房迪李阳刘思奇刘金丽商登辉
Owner GUIZHOU ZHENHUA FENGGUANG SEMICON
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