Anisotropic conductive adhesive and conductive film thereof

Abstract

The invention provides anisotropic conductive adhesive and a conductive film thereof. The conductive adhesive adopts a thermo-cured epoxy resin system as a base and comprises the following componentsby weight percent: 10 to 40 percent of epoxy resin, 0.5 to 10 percent of thermo-curing agent, 10 to 40 percent of film forming resin, 10 to 40 percent of rubber with carboxyl or hydroxyl, 0.1 to 5 percent of silane coupling agent, 0.1 to 5 percent of anti-aging agent, 1 to 10 percent of conductive spheres and the balance of solvent. The anisotropic conductive adhesive provided by the invention ishigh in reaction speed and short in curing time.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular, a conductive adhesive and a conductive film used for electrical connection between semiconductor electronic components. Background technique [0002] It is known that the development of semiconductor electronic components tends to be more and more miniaturized and refined. Correspondingly, the electrical connection between small-sized semiconductor devices also brings great challenges to the conductive adhesive used to connect and conduct circuits. [0003] This not only requires conductive adhesives to have high adhesion and reliability, but also to be able to accurately conduct microscopic circuits, especially to achieve anisotropic conduction of microscopic circuits, such as vertically conducting upper and lower circuits, and horizontally ensuring insulation. , the anisotropic conductive adhesive. [0004] At the same time, in addition to improving the performance of th...

AI Technical Summary

Problems solved by technology

[0007] First, for the epoxy resin system, the biggest problem is that the curing time is too long and the curing temperature is too high;

[0008] Second, for the acrylate system, there is mainly the problem of warping after curing;

[0009] Third, the bonding strength is not enough. It is not enough to increase the degree of adhesion inside the glue, and it is also necessary to consider how to increase the adhesion at the interface of the glued substrate;

[0010] Fourth, the conductive particles used are mainly gold balls, that is, the surface of the resin balls is plated with gold. On the one hand, the technology of gold plating is relatively difficult, and the process of producing gold balls is complicated. On the other hand, the price of gold balls is very high. Not conducive to reducing production costs;

Images