Thermosetting resin composition, and prepreg, laminated board, and high frequency circuit substrate containing thermosetting resin composition
A resin composition, thermosetting technology, applied in the direction of synthetic resin layered products, lamination, lamination equipment, etc., can solve the problems of decreased crosslink density, insufficient heat resistance, affecting electrical properties, etc., to improve hydrolysis resistance , Improve electrical properties, prevent hydrolysis
Active Publication Date: 2019-05-03
GUANGDONG SHENGYI SCI TECH
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Problems solved by technology
However, when polyphosphonate or / and phosphonate-carbonate copolymers are used as curing agents for epoxy resins, in order to achieve better electrical properties, the terminal hydroxyl groups will be blocked with aromatic acid chlorides or phenols, leading to a decrease in its cross-link density, T g Reduced, insufficient heat resistance and other shortcomings, but without hydroxyl end capping will greatly affect the electrical properties
Method used
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Embodiment 1-11
[0107] Prepare thermosetting resin composition according to the components shown in Table 1, and make laminate samples according to the following laminate manufacturing method:
[0108] Mix the components of the formula uniformly in the solvent, control the solid content of the glue solution to 65%, soak the above glue solution with 2116 glass fiber cloth, control the appropriate thickness, and then bake in an oven at 145-175°C for 2-15 minutes Make a prepreg, then stack several prepregs together, and put copper foil on the upper and lower sides of the prepreg. The curing temperature is 190-200℃ and the curing pressure is 30-60Kg / cm. 2 , The curing time is 90-120min to make copper clad laminate.
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The invention provides a thermosetting resin composition, and a prepreg, a laminated board, and a high frequency circuit substrate which contain the thermosetting resin composition. The thermosettingresin composition comprises, by weight, 5 to 15 parts of an aromatic poly carbodiimide, 30 to 70 parts of an epoxy resin, and 5 to 40 parts of hydroxyl-containing polyphosphoester and / or hydroxyl-containing phosphonate-carbonate copolymer; the melting point of the aromatic poly carbodiimide ranges from 100 to 160 DEG C. The prepreg, the laminated board, and the high frequency circuit substrate prepared from the thermosetting resin composition possess excellent dielectric properties, excellent heat resistance, relatively low water absorption rate, and excellent processing performance, and the flame resistance grade reaches UL94 V-0.
Description
Technical field [0001] The invention belongs to the technical field of thermosetting resin compositions, and relates to a thermosetting resin composition and prepregs, laminates and high-frequency circuit substrates using the thermosetting resin composition. Background technique [0002] With the high-speed and multi-function information processing of electronic products, the application frequency continues to increase. In addition to higher requirements for the heat resistance of laminate materials, the dielectric constant and dielectric loss are required to be lower and lower. Therefore, Reducing Dk / Df has become a hot spot for substrate manufacturers. Traditional FR-4 materials mostly use dicyandiamide as the curing agent. This curing agent has a tertiary reactive amine and has good process operability. However, due to its weak CN bond, it is easy to crack at high temperature, resulting in the curing of the cured product. The thermal decomposition temperature is low, which ca...
Claims
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Login to View More IPC IPC(8): C08L63/00C08L79/00C08L85/02B32B27/38B32B27/06B32B37/06B32B37/10
Inventor 黄天辉林伟游江
Owner GUANGDONG SHENGYI SCI TECH