Method for cutting silicon ingot, method for manufacturing silicon wafer, and silicon wafer

Abstract

Proposed is a method for suppressing contamination by nickel to less than the detection limit when cutting a silicon ingot having a diameter exceeding 300 mm using a fixed abrasive wire saw. A methodfor feeding a silicon ingot having a diameter exceeding 300 mm so as to press the silicon ingot against at least one fixed abrasive wire saw in which a plurality of abrasive grains are fixed onto thesurface of a wire while running the fixed abrasive wire saw, and cutting the silicon ingot, wherein the method is characterized in that the cutting of the silicon ingot is performed in a cutting timeof 30 hours or less.

Description

technical field [0001] The invention relates to a silicon ingot cutting method, a silicon wafer manufacturing method and the silicon wafer. Background technique [0002] A wire saw spirally winds a wire at regular intervals with respect to a plurality of rollers to form a wire row, runs the wire while supplying slurry, presses workpieces such as silicon ingots onto the wire row, and slices the workpiece cutting device. Wire saws are widely used in the process of slicing silicon ingots to produce silicon wafers, since multiple wafers can be cut out from a workpiece at the same time. [0003] figure 1 It is a schematic diagram of the main part of a general jigsaw. The wire saw 10 shown in this figure includes a wire drawing / coiling mechanism (not shown) for drawing or winding a wire 20 , main rollers 30 arranged in parallel at predetermined intervals, and a mechanism for supplying coolant to the main rollers 30 . The nozzle 40 and the nozzle 50 for supplying the slurry to ...

AI Technical Summary

Problems solved by technology

However, when cutting such a large-diameter silicon ingot with a free-grain wire saw, there are problems caused by the use of slurry

For example, since slurry adheres to wafers obtained by dicing, the slurry is removed in the subsequent cleaning process, but the removal of the slurry takes time

In addition, the slurry supplied during processing scatters and adheres to the wire saw device or its surroundings, and it is difficult to remove the attached slurry.

In addition, in the free abrasive wire saw, the slicing process is performed by the grinding action of the abrasive grains contained in the slurry, so the processing speed is slower than that of the conventional inner peripheral sharpening stone.

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