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1064nm laser

A laser and optical path technology, applied in the direction of lasers, laser parts, laser parts, etc., can solve the problems of fragility, unstable resonator, low beam quality, etc., to facilitate transportation and storage, reduce floor space, shorten The effect of overall length

Pending Publication Date: 2019-05-17
广州安特激光技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, compared with lower power lasers, high power lasers generate a lot of heat due to their pumping, and the thermal lens generated by too much heat can cause the resonator to be unstable, resulting in poor beam quality
Many hard materials are extremely expensive and fragile, so the requirements for processing yield are extremely high
However, the infrared lasers currently on the market are either not powerful enough, or the beam quality of the enough power is not enough, and the yield rate of the processed parts is very low.
In addition, the current lasers are large in size, and the beam contains more light of different wavelengths, and the beam quality is low, which cannot be applied to the field of precision processing of high-end superhard materials

Method used

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  • 1064nm laser
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Embodiment

[0023] The specific embodiment of the present invention is as figure 1 and figure 2 As shown, a 1064nm laser includes a housing 15, which includes a semiconductor side pump module 1, and the semiconductor side pump module 1 can emit 1064nm laser, but due to the low quality of the emitted laser light, the slave laser Corresponding treatment is required before injection. The semiconductor side pump module 1 is provided with a first optical path output end and a second optical path output end; outside the first optical path output end of the semiconductor side pump module 1, an acousto-optic switch 2, a first aperture diaphragm 3 and a second optical path are arranged in sequence. A total mirror 4. The first total reflection mirror 4 is perpendicular to the optical path. Outside the output end of the second optical path, a polarization combination plate 7, a second aperture stop 8 and an output mirror 9 are arranged in sequence, and the output ratio of the output mirror 9 is ...

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PUM

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Abstract

The invention discloses a 1064 laser, comprising a shell, a semiconductor side pump module is contained in the shell, and the semiconductor side pump module is provided with a first light path outputterminal and a second light path output terminal; an acousto-optic switch, a first finepored diaphragm and a first total reflection mirror are sequentially arranged outside the first light path outputterminal of the semiconductor side pump module, a polarization combination piece, a second finepored diaphragm and an output mirror are sequentially arranged outside the second light path output terminal, and the output rate T of the output mirror is 13-32%. The 1064nm laser provided by the invention has low light spot deviation value, quality of a light beam is high and stable, a cut surface ona hard material is smooth, and precise cutting can be realized.

Description

technical field [0001] The invention relates to the field of laser removal processing of hard materials, in particular to a 1064nm laser. Background technique [0002] Hard raw materials need to be removed and processed before they can be used as products and applied in corresponding fields. Hard materials need to be cut on different sides during processing. At present, most of the processing methods for hard materials are mechanical cutting, manual grinding and polishing, etc., and the operation is complicated. Among them, mechanical cutting requires high-speed running parts, such as saw discs, which swing to a certain extent when they run fast, resulting in high precision. Low, the moving parts are easy to raise the dust generated when cutting super-hard materials, the pollution is large, and the noise of mechanical cutting is also large. [0003] With the continuous maturity of laser generators, the use of lasers in cutting is becoming more and more extensive. The lase...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01S3/081H01S3/117H01S3/10H01S3/02
Inventor 陈义红陈聪李文蔡永辉李陵江
Owner 广州安特激光技术有限公司
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