Array substrate and manufacturing method thereof, display panel, electronic device
The technology of an array substrate and a flexible substrate is applied in the field of electronic equipment, array substrate and its manufacturing method, and display panel, and can solve the problems of capacitor leakage, uneven gray scale of the display panel, and high leakage current, and achieve the improvement of gray scale uniformity, Weaken the effect of floating body and reduce the effect of leakage current
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Embodiment 1
[0042] Reference attached figure 2 , an array substrate provided by an embodiment of the present invention, which includes a driving TFT and a switching TFT,
[0043] Wherein, the driving TFT includes a polysilicon layer 3, a top gate 4 and a bottom gate 5;
[0044] Both ends of the polysilicon layer 3 are electrically connected to the source S and the drain D respectively;
[0045] The top gate 4 and the bottom gate 5 are respectively arranged on the upper side and the lower side of the polysilicon layer 3 for reducing the floating body effect between the drain D and the source S.
[0046] Specifically, in order to solve the problem that the leakage current of the polysilicon active layer material in the LTPO process is too high, and the floating body effect is prone to occur during the application process to cause capacitance leakage, which in turn affects the circuit compensation circuit, and finally leads to uneven gray levels of the display panel. Problem, the present i...
Embodiment 2
[0061] Further, refer to the attached Figure 5 , a method for manufacturing an array substrate provided by an embodiment of the present invention, in a specific implementation, includes the following steps:
[0062] It should be noted that this embodiment is aimed at the case where the top gate 4 is set as indium gallium zinc oxide (IGZO), and the bottom gate 5 is set as a metal gate (Gate-1):
[0063] S1. Coating a flexible substrate 13 on a glass substrate to form a flexible substrate 9, and making a bottom gate 4 on the upper side of the flexible substrate 9;
[0064] S2, depositing silicon on the upper side of the bottom gate 4 and performing polycrystallization and patterning treatment to form a polysilicon layer 3;
[0065] S3, sputtering the top gate 5 on the upper side of the polysilicon layer 3 and patterning it;
[0066] S4 , making through holes 14 for source S and drain D (Drain) on the upper side of the top gate 5 , sputtering and patterning the through holes 1...
Embodiment 3
[0078] Further, refer to the attached Image 6 , a method for manufacturing an array substrate provided by an embodiment of the present invention, in a specific implementation, includes the following steps:
[0079] It should be noted that in this embodiment, the top gate 4 is set as a metal gate (Gate-1) and kept on the upper side of the polysilicon layer 3, and the bottom gate is added on the lower side of the polysilicon layer 3. The case of pole 5 (Gate-3):
[0080] Coating polyimide (PI) on a glass substrate (Glass) as a flexible substrate 9, depositing silicon oxide on the flexible substrate 9 as a first buffer layer (Buffer-o) 8, then sputtering a metal layer and doing Patterning to form the bottom gate 5 (Gate-3), and then depositing the first insulating layer GI1 (Gate insulator) 6;
[0081] After depositing amorphous Si on the first insulating layer GI1 (Gate insulator) 6, perform laser annealing (ELA) treatment to form polysilicon (Poly-Si), and then perform patte...
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