Embedment glue based on PBA embedment and zero-bubble embedment method

A glue and potting technology, which is applied in the direction of adhesives, epoxy glue, adhesive types, etc., can solve the problems of potting glue sealing performance, easy to generate air bubbles, unsatisfactory potting effect, etc., to achieve potting effect Good, avoid air bubbles, improve curing speed and bond strength

Inactive Publication Date: 2019-05-31
XINAN JIANGSU ELECTRIC APPLIANCE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The application of potting glue is more and more extensive. According to the system, it can be divided into epoxy potting glue, silicone potting glue, polyurethane potting glue, etc., and according to the application, it can be divided into transparent, heat-conducting, and flame-retardant potting glue. Potting glue has its own advantages, but the preparation of potting glue and the method of potting will have a direct impact on the effect of potting. Generally, when potting glue is potting, it is easy to generate air bubbles, resulting in unsatisfactory potting effect, and The setting time process of the potting glue will affect its sealing effect, and the long-term use will also affect the sealing performance of the potting glue

Method used

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  • Embedment glue based on PBA embedment and zero-bubble embedment method
  • Embedment glue based on PBA embedment and zero-bubble embedment method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] A potting glue based on PBA potting, the components of the potting glue are: 25 parts by weight of isocyanate, 10 parts of polyester polyol, 25 parts of vinyl acetate, 2 parts of polyvinyl silicone oil, and 4 parts of polyoxyethylene , 15 parts of bisphenol A epoxy resin, 4 parts of curing agent, 1 part of coupling agent, and 10 parts of solvent.

[0022] Wherein, the isocyanate is one or more of T-100, HDI, IPDI or hydrogenated MDI.

[0023] Among them, the polyester polyol is a polyester polyol with a functionality of 2.3 and a number average molecular weight in the range of 800-1500.

[0024] Further, the curing agent is a modified amine curing agent.

[0025] Still further, the solvent is one or more of toluene, ethyl acetate or DMF.

[0026] Still further, a kind of potting glue based on PBA potting and a zero-bubble potting method, the zero-bubble potting method is the following steps:

[0027] S1. Add isocyanate and polyester polyol into the vacuum reaction ta...

Embodiment 2

[0033] A potting glue based on PBA potting, the components of the potting glue are: 35 parts by weight of isocyanate, 20 parts of polyester polyol, 40 parts of vinyl acetate, 5 parts of polyvinyl silicone oil, and 8 parts of polyoxyethylene , 25 parts of bisphenol A epoxy resin, 7 parts of curing agent, 3 parts of coupling agent, and 25 parts of solvent.

[0034] Wherein, the isocyanate is one or more of T-100, HDI, IPDI or hydrogenated MDI.

[0035] Among them, the polyester polyol is a polyester polyol with a functionality of 2.3 and a number average molecular weight in the range of 800-1500.

[0036] Further, the curing agent is a modified amine curing agent.

[0037] Still further, the solvent is one or more of toluene, ethyl acetate or DMF.

[0038] Still further, a kind of potting glue based on PBA potting and a zero-bubble potting method, the zero-bubble potting method is the following steps:

[0039] S1. Add isocyanate and polyester polyol into the vacuum reaction t...

Embodiment 3

[0045] A potting glue based on PBA potting, the components of the potting glue are: 30 parts by weight of isocyanate, 15 parts of polyester polyol, 30 parts of vinyl acetate, 3 parts of polyvinyl silicone oil, and 6 parts of polyoxyethylene , 20 parts of bisphenol A epoxy resin, 6 parts of curing agent, 2 parts of coupling agent and 22 parts of solvent.

[0046] Wherein, the isocyanate is one or more of T-100, HDI, IPDI or hydrogenated MDI.

[0047] Among them, the polyester polyol is a polyester polyol with a functionality of 2.3 and a number average molecular weight in the range of 800-1500.

[0048]Further, the curing agent is a modified amine curing agent.

[0049] Still further, the solvent is one or more of toluene, ethyl acetate or DMF.

[0050] Still further, a kind of potting glue based on PBA potting and a zero-bubble potting method, the zero-bubble potting method is the following steps:

[0051] S1. Add isocyanate and polyester polyol into the vacuum reaction tan...

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Abstract

The invention discloses embedment glue based on PBA embedment and a zero-bubble embedment method, and relates to the technical field of PBA embedment. The embedment glue is prepared from, by weight, 25-35 parts of isocyanate, 10-20 parts of polyester polyol, 25-40 parts of vinyl acetate, 2-5 parts of polyvinyl silicone oil, 4-8 parts of polyoxyethylene, 15-25 parts of bisphenol-A epoxy resin, 4-7parts of a curing agent, 1-3 parts of a coupling agent and 10-25 parts of a solvent. The embedment glue of the design is prepared through vacuum mixing; the polyvinyl silicone oil and other reaction compounds have the chemical reaction, so the problem of releasing organic small molecules in the reaction process is solved, and the environmental protection aim is achieved; by adding the bisphenol-Aepoxy resin, the curing speed and adhering speed of the embedment glue are improved; meanwhile, by means of the embedment method of the design, the zero-bubble embedment of the embedment glue can be realized when embedment is conducted on a product, operation is simple, and the embedment effect is good.

Description

technical field [0001] The invention relates to the technical field of PBA potting, in particular to a potting glue based on PBA potting and a zero-bubble potting method. Background technique [0002] Potting is to pour the liquid polyurethane compound into the device equipped with electronic components and circuits by mechanical or manual methods, and solidify it into a thermosetting polymer insulating material with excellent performance under normal temperature or heating conditions. The liquid polyurethane compound used in this process is the potting compound. [0003] The application of potting glue is more and more extensive. According to the system, it can be divided into epoxy potting glue, silicone potting glue, polyurethane potting glue, etc. Potting glue has its own advantages, but the preparation of potting glue and the method of potting will have a direct impact on the effect of potting. Generally, when potting glue is potting, it is easy to generate air bubbles...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/06C09J163/00C09J183/07C09J171/02
Inventor 葛晓红
Owner XINAN JIANGSU ELECTRIC APPLIANCE CO LTD
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