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Tin-protecting PCB film-removing liquid

A film liquid and life-span technology, applied in the application of non-metallic protective layer, secondary treatment of printed circuit, photosensitive material processing, etc., can solve the problem of poor alkali resistance of tin layer, increase of tin plating and tin stripping cost, tin layer corrosion, etc. problems, to achieve the effect of improving processing capacity, improving film removal efficiency, and promoting tearing

Inactive Publication Date: 2019-05-31
上海富柏化工有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the production process of printed circuit boards, the photoresist film needs to be removed before it is etched. In this process, the chemical removal of the photoresist film on the substrate is generally performed Composition is stripped, and the commonly used stripping solution is sodium hydroxide 3-4% aqueous solution, but because the tin layer is not alkali-resistant, while stripping the resist film, the sodium hydroxide will affect the tin layer Corrosion is caused, and the tin layer must be thickened to compensate, which greatly increases the cost of tin plating and stripping

Method used

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  • Tin-protecting PCB film-removing liquid
  • Tin-protecting PCB film-removing liquid
  • Tin-protecting PCB film-removing liquid

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Since the proportioning process of the present invention is the same as that of commonly used film removal solutions and is well known by those skilled in the art, it will not be described in detail.

[0029] A tin protection type PCB film removal solution, comprising the following parts by weight:

[0030]

[0031]

[0032] Among them, the tin protecting agent is 10 parts of imidazole, 12 parts of alkyl imidazole, and 11 parts of benzotriazole.

[0033] The life extension agent is 16 parts of glycerin and 10 parts of isopropanol.

[0034] The accelerator is 12 parts of ethanolamine and 11 parts of triethanolamine.

[0035] The polymer polyether compound is propylene glycol block polyether with a molecular weight of 1000 and trimethylolpropane polyether with a molecular weight of 500, and the mixing ratio is 1:1 by weight.

Embodiment 2

[0037] A tin protection type PCB film removal solution, comprising the following parts by weight:

[0038]

[0039] The tin protecting agent is 12 parts of imidazole, 9 parts of sodium citrate and 9 parts of urea.

[0040] The life extension agent is glycerin and polyethylene glycol with a molecular weight of 300.

[0041] The accelerator is 12 parts of ethanolamine and 11 parts of triethanolamine.

[0042] The polymer polyether compound is a propylene glycol block polyether with a molecular weight of 1200 and a trimethylolpropane polyether with a molecular weight of 700, and the mixing ratio is 1:1 by weight.

Embodiment 3

[0044] A tin protection type PCB film removal solution, comprising the following parts by weight:

[0045]

[0046]

[0047] Among them, the tin protecting agent is 13 parts of benzotriazole, 11 parts of sodium citrate, 9 parts of urea, and 11 parts of tetrahydrosugar alcohol.

[0048] The life extension agent is polyethylene glycol with 11 parts of isopropanol and a molecular weight of 400.

[0049] The accelerator is 14 parts of ethanolamine and 8 parts of ammonia water.

[0050] The polymer polyether compound is propylene glycol block polyether with a molecular weight of 1300 and trimethylolpropane polyether with a molecular weight of 800, and the mixing ratio is 1:1 by weight.

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PUM

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Abstract

The invention discloses a tin-protecting PCB film-removing liquid and relates to the field of circuit board production and processing to solve the problem that a traditional film-removing liquid causes serious damage to a tin layer during a film-removing process. The tin-protecting PCB film-removing liquid includes the following components, by weight, 10 to 25 parts of sodium hydroxide, 1 to 6 parts of tin-protecting agent, 2 to 7 parts of life extender, 3 to 15 parts of accelerator, 5 to 19 parts of long-chain fatty amine, 9 to 26 parts of polymer polyether compound, and 90 to 160 parts of distilled water. The tin-protecting PCB film-removing liquid can protect the tin layer during the film-removing process in order not to corrode the tin layer by alkali, is fast in film stripping speed and stable, has a bath solution with a long service life, no impurities, a clean surface, and less discharged waste liquid, and achieves a purpose of energy saving and emission reduction.

Description

technical field [0001] The invention relates to the field of circuit board production and processing, more specifically, it relates to a tin-protecting type PCB film removal solution. Background technique [0002] In the production process of printed circuit boards, the photoresist film needs to be removed before it is etched. In this process, the chemical removal of the photoresist film on the substrate is generally performed Composition is stripped, and the commonly used stripping solution is sodium hydroxide 3-4% aqueous solution, but because the tin layer is not alkali-resistant, while stripping the resist film, the sodium hydroxide will affect the tin layer Corrosion is caused, and the tin layer must be thickened to compensate, which greatly increases the cost of tin plating and tin stripping. Contents of the invention [0003] Aiming at the deficiencies in the prior art, the purpose of the present invention is to provide a tin-protecting PCB film removal solution, w...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/28G03F7/42
Inventor 饶猛夏金良莫庆生
Owner 上海富柏化工有限公司
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