Coupling structure and packaging structure of laser and silicon light chip

Abstract

The invention discloses a coupling structure of a laser and a silicon optical chip. The coupling structure comprises a laser, a collimating lens, an isolator, a coupling lens, an optical fiber and thesilicon optical chip which are arranged in sequence; the collimating lens and the coupling lens share an optical axis; the optical fiber and the silicon optical chip are connected with each other; light emitted by the laser after passing through the collimating lens enters the isolator, then enters the coupling lens to be gathered at the optical fiber and finally enters the silicon optical chip through the optical fiber. The invention also discloses a packaging structure of the laser and the silicon optical chip. The packaging structure comprises a light emission assembly, the optical fiber and the silicon optical chip which are connected one by one; the light emission assembly comprises the laser, the collimating lens, the isolator and the coupling lens; the light emitting assembly is packaged by adopting a TOSA (Light Emission Module) technology; and the laser is packaged by adopting TO (Transistor Outline) technology.

Description

technical field [0001] The invention relates to the technical field of light-emitting communication, and more precisely relates to a coupling structure and packaging structure of a laser and a silicon optical chip. Background technique [0002] With the continuous development of optical communication technology, optoelectronic devices are developing in the direction of smaller size, higher integration and lower cost. Integrated circuit chips are generally manufactured on silicon chips using complementary metal-oxide-semiconductor integration technology, which already has a very mature manufacturing process. Now some manufacturers make waveguides on the side of silicon-based substrates for optical transmission, so that the functions of integrated circuit chips A silicon photonics chip is a silicon photonics chip that is integrated with the functions of an optical chip on the same silicon chip. Silicon photonic chips can not only realize electrical signal processing functions...

AI Technical Summary

Problems solved by technology

Among the above three schemes, the process of scheme 1 is complicated, the reliability of the chip is not high, and there is a lattice mismatch between the silicon material and the III-V semiconductor optoelectronic material itself. There will be many lattice defects, which will generate relatively large stress and affect the reliability of the chip; the processing technology of the light source component in the second scheme, the sealing process is more complicated, and the process cost is relatively high; the third scheme is to flip the laser chip waveguide on the silicon waveguide Above, evanescent wave coupling requires ultra-high-precision coupling and alignment equipment, which has high requirements for equipment and technology

To sum up, the existing technologies for realizing silicon light sources have certain defects, and there is a large room for improvement.

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