Process for metallizing nonconductive plastic surfaces
A surface metal and metallization technology, which is applied in the coating process of metal materials, printed circuits, electrical components, etc.
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Embodiment 1
[0132] Example 1: Inventive Example
[0133] ABS plastic panels (Novodur P2MC from Ineos) with dimensions 5.2 cm x 14.9 cm x 3 mm were fixed on stainless steel wires. The panels were immersed for 10 minutes in a solution of 15% 2-(2-ethoxyethoxy)ethyl acetate and 10% butoxyethanol, which had been adjusted to pH = 7 with potassium phosphate buffer and placed in an incubator Maintain at 45°C (pretreatment step). Subsequently, the panels were rinsed under running water for about 1 minute and then introduced into a bath of 100 g / L sodium permanganate and 10 g / L 96% sulfuric acid maintained at 70 °C (process step A)). After the 10 minute treatment time, rinse again in water for 1 minute and the dark brown panel is now cleaned in a solution of 50 g / L 96% sulfuric acid and 30 ml / L 30% hydrogen peroxide to remove deposited manganese dioxide (process step A i)). After subsequent rinsing and brief immersion into 300 ml / L 36% hydrochloric acid solution (process step A ii)), the pane...
Embodiment 2
[0138] Embodiment 2: comparative experiment
[0139] Four panels of Bayblend T45 (5.2 x 14.9 x 0.3 cm, ABS / PC mixture) were treated in a 40% solution of ethyl 2-(2-ethoxyethoxy)acetate for 10 minutes at room temperature. After rinsing, a warm (70°C) acidic permanganate solution containing 100 g / L sodium permanganate and 10 g / L 96% sulfuric acid (inventive etching solution I, final concentration: 0.1 molar / L sulfuric acid) to treat both panels. The other two panels were tested under the same conditions in a similar permanganate solution containing 100 g / L 96% sulfuric acid (etching solution II with a higher concentration of sulfuric acid than the inventive etching solution, final concentration: 1 mol / L sulfuric acid) processing. After treatment, the panel surface that had been treated with etching solution II was much darker than the panel surface that had been treated with etching solution I with only 10 g / L 96% sulfuric acid. Etching solutions II with a higher sulfuric ...
Embodiment 3
[0148] Embodiment 3: comparative experiment
[0149] Four panels of Bayblend T45 (5.2 x 14.9 x 0.3 cm, ABS / PC mixture) were treated as described in Example 2. However, etching (process step A)) was carried out under conditions different from those specified in Example 2.
[0150] Two of the four panels were treated with etching solution III (chromium sulfuric acid solution from prior art) consisting of 380 g / L chromium(VI) oxide and 380 g / L concentrated sulfuric acid. The etching treatment was performed at 70° C. for 10 minutes.
[0151] The other two panels were treated with etching solution IV (alkaline permanganate solution from the prior art) consisting of 30 g / L sodium permanganate and 20 g / L sodium hydroxide. The etching treatment was performed at 70° C. for 10 minutes.
[0152] For panels that have been treated with etching solution III, an adhesion strength of 0.45 N / mm-0.70 N / mm was found, and, for panels that have been treated with etching solution IV, an adhesi...
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Abstract
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