Insulating resin composition and laminate obtained therefrom

a technology of insulation resin and composition, which is applied in the direction of synthetic resin layered products, non-metallic protective coating applications, solid-state devices, etc., can solve the problems of resin composition not providing a sufficiently high peel strength against a plating metal, the dispersed particles are still too large in diameter, and the impact resistance and adhesiveness cannot be realized
US6780502B2Inactive Publication Date: 2004-08-24NIPPON STEEL CHEMICAL CO LTD
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Patent Information

Authority / Receiving Office
US · United States
Patent Type
Patents(United States)
Current Assignee / Owner
NIPPON STEEL CHEMICAL CO LTD
Publication Date
2004-08-24
Estimated Expiration
Not applicable · inactive patent

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Abstract

This invention relates to an insulating resin composition which exhibits high impact resistance and heat resistance and good adhesiveness to the plating metal, is selectively etchable by a permanganate salt commonly used in a plating operation and suited for an insulating layer in multilayer wiring boards. The insulating resin composition is a photo-polymerizable or thermally polymerizable resin composition comprising 3-10 parts by weight of a crosslinked elastic polymer per 100 parts by weight of a resin component (excluding the crosslinked elastic poly and including monomers) and said crosslinked elastic polymer has carboxyl groups and is dispersed with an average secondary particle diameter in the range of 0.5-2 mum.
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Description

FIELD OF TECHNOLOGYThis invention relates to an insulating resin composition which is suited for a solder resist or a plating resist in the fabrication of circuit boards and for an insulating film and a photosensitive adhesive for the build-up of multilayer wiring boards for mounting semiconductor devices, to a laminate obtained from said composition and to a cured product of said composition.BACKGROUND TECHNOLOGYFollowing the trend of electronic instruments towards advanced miniaturization and higher performance in recent years, there is a trend toward higher circuit density in the printed circuit boards which are used in electronic instruments and insulating resin materials to be used in printed circuit boards are required to show finer processibility. Patterning by exposure to light and development has been known as an effective technique for fine processing of insulating resin materials; this technique has relied on the use of photosensitive resin compositions and there are pres...

Claims

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