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Polysiloxane modified cyanate resin base shape memory material with high glass-transition temperature and preparation method thereof

A technology of cyanate ester resin and transition temperature, which has good application prospects in all fields, can solve the problem of low use temperature, and achieve the effects of improved shape memory performance, excellent mechanical properties and low cost

Inactive Publication Date: 2019-06-28
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Aiming at the problems of low service temperature of current shape memory polymers, the first object of the present invention is to provide a compound modification with high polydimethylsiloxane, epoxy resin and cyanate resin with high Polysiloxane-modified cyanate ester resin-based shape memory material with good glass transition temperature and high temperature resistance

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  • Polysiloxane modified cyanate resin base shape memory material with high glass-transition temperature and preparation method thereof
  • Polysiloxane modified cyanate resin base shape memory material with high glass-transition temperature and preparation method thereof
  • Polysiloxane modified cyanate resin base shape memory material with high glass-transition temperature and preparation method thereof

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Embodiment 1

[0032] The preparation method of polysiloxane-modified cyanate resin-based shape memory material is as follows: weigh 100 g of AL-3040 epoxy resin, 120 g of hydroxyl-terminated polydimethylsiloxane, KH-550 silane coupling 20g of the agent, heated to 100°C, stirred and mixed evenly. Subsequently, 1 g of dibutyltin dilaurate as a catalyst was added, and the stirring reaction was continued for 2 h to obtain a compatibilizer. Add bisphenol E type cyanate 240g subsequently, continue stirring reaction 1h. The obtained prepreg is vacuum-extracted to remove air bubbles, then poured into the mold under normal pressure, and finally cured according to the curing process 120°C / 4h+150°C / 2h+170°C / 2h to obtain toughened hydroxyl-terminated polydimethylsiloxane Cyanate resin based shape memory materials.

[0033] The compatibilizer was prepared by hydroxyl-terminated polydimethylsiloxane, KH-550 silane coupling agent and AL-3040 epoxy resin. Utilize the good compatibility between AL-3040 e...

Embodiment 2

[0037] The preparation method of polysiloxane-modified cyanate resin-based shape memory material is as follows: weigh 66.7g of AL-3040 epoxy resin, 80g of hydroxyl-terminated polydimethylsiloxane, KH-550 silane dimethicone according to the above mass fractions. 13.3g of the joint agent, heated to 100°C, stirred and mixed evenly. Subsequently, 0.67 g of dibutyltin dilaurate as a catalyst was added, and the stirring reaction was continued for 2 h to obtain a compatibilizer. Subsequently, 240 g of bisphenol E type cyanate was added, and the stirring reaction was continued for 1 h. The obtained prepreg is vacuum-extracted to remove air bubbles, then poured into the mold under normal pressure, and finally cured according to the curing process 120°C / 4h+150°C / 2h+170°C / 2h to obtain toughened hydroxyl-terminated polydimethylsiloxane Cyanate resin based shape memory materials.

[0038] The content of the compatibilizer in the toughened and modified cyanate resin-based shape memory mat...

Embodiment 3

[0041] The preparation method of polysiloxane-modified cyanate resin-based shape memory material is as follows: weigh 50 g of AL-3040 epoxy resin, 60 g of hydroxyl-terminated polydimethylsiloxane, KH-550 silane coupling 10g of the agent, heated to 100°C and then stirred and mixed evenly. Subsequently, 0.5 g of dibutyltin dilaurate as a catalyst was added, and the stirring reaction was continued for 2 h to obtain a compatibilizer. Add bisphenol E type cyanate 240g subsequently, continue stirring reaction 1h. The obtained prepreg is vacuum-extracted to remove air bubbles, then poured into the mold under normal pressure, and finally cured according to the curing process 120°C / 4h+150°C / 2h+170°C / 2h to obtain toughened hydroxyl-terminated polydimethylsiloxane Cyanate resin based shape memory materials.

[0042] The content of the compatibilizer in the toughened and modified cyanate resin-based shape memory material obtained by the hydroxyl-terminated polydimethylsiloxane obtained ...

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Abstract

The invention discloses a polysiloxane modified cyanate resin base shape memory material with high glass-transition temperature and a preparation method thereof. The shape memory material is obtainedby thermocuring HPDMS, epoxy resin, a silane coupling agent, cyanate and the like. The prepared shape memory material is high in strength and modulus and excellent in shape memory performance, has thehigh glass-transition temperature and can adapt to the environment with the high working temperature, the preparation technology is simple, operation is convenient, and industrial production is facilitated.

Description

technical field [0001] The invention relates to a shape-memory material, in particular to a cyanate resin-based shape-memory material toughened by polysiloxane. Temperature has good application prospects in the fields of biomedicine, textiles, packaging, and aerospace, and belongs to the technical field of shape memory polymer functional materials. Background technique [0002] Shape memory polymer (SMP) is a new type of intelligent material with broad application prospects. It has good application prospects in the fields of biomedicine, textiles, packaging, and aerospace, especially in the field of aerospace, which has attracted widespread attention. In the field of aerospace, shape memory materials are mainly used in satellite detection loads, such as antennas, extension arm structures, trusses and other deployable structures. At present, shape memory polymers are mainly polynorbornene, polyurethane, styrene-butadiene copolymer, epoxy resin and the like. Its glass trans...

Claims

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Application Information

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IPC IPC(8): C08L79/04C08L83/04C08L63/00C08K5/544
Inventor 李芝华胡建康
Owner CENT SOUTH UNIV
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