Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Stylus pen point composite material, stylus pen, and pen point moulding method

A technology of composite materials and molding methods, which is applied in the fields of instruments, electrical digital data processing, and data processing input/output processes, etc., can solve problems such as insufficient writing, large damping, and poor user experience.

Active Publication Date: 2019-07-02
广州视焓科技有限公司
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In terms of writing experience, the rubber stylus tip is soft and does not make too much noise when writing, but usually due to the large damping, the writing is not smooth enough, and it is easy to get tired after long-term use; the plastic material has higher hardness and smooth writing. However, it is often accompanied by a large screen impact sound, which may even cause damage to the screen after long-term use; the fiber felt pen tip material can balance the impact sound and smoothness of the screen to a certain extent, but there is a certain probability of sharp abnormal noise, and the user poor experience

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Stylus pen point composite material, stylus pen, and pen point moulding method
  • Stylus pen point composite material, stylus pen, and pen point moulding method
  • Stylus pen point composite material, stylus pen, and pen point moulding method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] In order to facilitate the understanding of the present invention, the following will describe the present invention more fully. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0025] The invention provides a stylus tip composite material, which includes the foll...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Particle size meshaaaaaaaaaa
Heat distortion temperatureaaaaaaaaaa
Melt indexaaaaaaaaaa
Login to View More

Abstract

The invention relates to a stylus pen point composite material, a stylus pen, and a pen point moulding method. The stylus pen point composite material comprises powdery ultrahigh molecular weight polyethylene, powdery low density polyethylene, silicone oil, calcium stearate, a lubricant, carbon black, and light calcium carbonate. According to the pen point moulding method, sintering moulding is adopted, so that influences of the poor fluidity of ultrahigh molecular weight polyethylene are avoided, and limit caused by molecular weight value is avoided. Further study modification on the components of the stylus pen point composite material is carried out, different components are added for cooperation, so that the obtained pen point is low in noise and high in smoothness, and user experiencesimilar to that of conventional writing mode is provided.

Description

technical field [0001] The invention relates to the field of touch technology, in particular to a composite material for a stylus tip, a stylus pen and a method for forming the tip thereof. Background technique [0002] With the popularization of touch screens in people's life and work, the stylus, which has the advantages of high touch precision, rich expansion functions and conformity to consumers' usage habits, has gradually become one of the mainstream human-computer interaction methods. In order to achieve the user experience closest to that of a pen or pencil when writing on paper, it is necessary to optimize the material of the nib and adjust the processing and molding process. [0003] Currently, the popular stylus tips on the market are generally made of three types of materials: rubber, plastic and fiber felt. In terms of writing experience, the rubber stylus tip is soft and does not make too much noise when writing, but usually due to the large damping, the writi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C08L23/06C08L83/04C08K5/098C08K3/04C08K3/26G06F3/0354B29C43/00B29K23/00
CPCC08L23/06G06F3/03545B29C43/006B29K2023/0683B29K2023/0633C08L2205/03C08L2205/025C08L2207/068C08L2207/066C08K2003/265C08K2201/001C08L83/04C08K5/098C08K3/04C08K3/26
Inventor 万虎冯先强
Owner 广州视焓科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products