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Substrates for High Frequency Printed Wiring Boards

A printed circuit board and base material technology, which is applied in the fields of printed circuit, printed circuit, printed circuit manufacturing, etc., can solve the problems of low bonding strength between dielectric layer and copper foil, small surface energy of fluororesin, etc.

Active Publication Date: 2022-05-06
SUMITOMO ELECTRIC IND LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At the same time, since the surface energy of the fluororesin is small, the bonding strength between the dielectric layer and the copper foil is small

Method used

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  • Substrates for High Frequency Printed Wiring Boards
  • Substrates for High Frequency Printed Wiring Boards
  • Substrates for High Frequency Printed Wiring Boards

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0038] Such as figure 1 As shown, a base material 1 for a high-frequency printed wiring board according to the first embodiment includes a dielectric layer 2 and a copper foil 3 laminated on the dielectric layer 2 . This base material for a high-frequency printed wiring board is used as a base material of a printed wiring board.

[0039] (dielectric layer)

[0040] The dielectric layer 2 contains a fluororesin and an inorganic filler.

[0041](fluororesin)

[0042] The fluororesin refers to a resin in which at least one hydrogen atom bonded to a carbon atom contained in a repeating unit of a polymer chain is replaced by a fluorine atom or an organic group containing a fluorine atom (hereinafter, also referred to as "fluorine atom-containing group") substitution. The fluorine atom-containing group is a group in which a fluorine atom replaces at least one hydrogen atom in a linear or branched organic group. Examples of the fluorine atom-containing group include a fluoroalky...

no. 2 approach

[0092] Such as figure 2 As shown, a base material 1' for a high-frequency printed wiring board according to the second embodiment includes: two dielectric layers 2 laminated on each other; and two copper foils 3 laminated on these dielectric layers 2, respectively. The base material 1' for a high-frequency printed wiring board generally has a structure in which two base materials 1 for a high-frequency printed wiring board are laminated|stacked on each other so that the side which opposes the copper foil 3 of each dielectric layer 2 faces each other.

[0093] In base material 1' for a high-frequency printed wiring board, dielectric layer 2 and copper foil 3 are the same as dielectric layer 2 and copper foil 3 in base material 1 for high-frequency printed wiring board, respectively.

no. 3 approach

[0095] Such as Figure 4 As shown, a base material 1A for a high-frequency printed wiring board according to the third embodiment includes: a dielectric layer 2 including a layer 2A and a layer 2B; and a copper foil 3 laminated on the layer 2A. Layer 2A is a layer which contains a fluororesin and contains no inorganic filler or contains an inorganic filler in a content lower than that in layer 2B. Layer 2B is a layer containing a fluororesin and an inorganic filler.

[0096] In the base material 1A for a high-frequency printed wiring board, the layer 2B and the copper foil 3 are the same as the dielectric layer 2 and the copper foil 3 in the base material 1 for a high-frequency printed wiring board, respectively. When the dielectric layer 2 of the base material 1 for a high-frequency printed wiring board does not contain an inorganic filler, the layer 2A is the same as the dielectric layer 2 of the base material 1 .

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Abstract

In a first embodiment, a base material for a high-frequency printed wiring board includes: a dielectric layer containing a fluororesin and an inorganic filler; and a copper foil laminated on at least one surface of the dielectric layer. In the base material for high-frequency printed wiring boards, the maximum height roughness (Rz) of the surface of the copper foil on the dielectric layer side is 2 μm or less, and in the surface layer region of the dielectric layer on the copper foil side, the inorganic atoms in the inorganic filler The ratio of the number of atoms to the number of fluorine atoms in the fluororesin is 0.08 or less.

Description

technical field [0001] The present disclosure relates to a base material for a high-frequency printed wiring board. This application claims priority based on Japanese Patent Application No. 2017-153721 filed on August 8, 2017, the entire contents of which are incorporated herein by reference. Background technique [0002] In recent years, the communication volume of information has been increasing. For example, in devices such as IC cards and mobile phone terminals, communication is frequently performed in high-frequency regions such as microwaves and millimeter waves. Therefore, there is a need for a printed wiring board capable of reducing transmission loss when used in such a high-frequency region, that is, a printed wiring board excellent in high-frequency characteristics. As a base material for producing such a high-frequency printed wiring board, a base material in which a copper foil is laminated on a dielectric layer is generally used. [0003] As a technique for ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/03B32B15/08B32B15/082B32B15/20B32B27/20B32B27/30
CPCH05K1/034H05K1/0373H05K2201/0355H05K2201/015H05K2201/0209H05K1/09H05K1/0271H05K3/0055H05K3/381H05K2203/1194H05K2201/0269H05K2201/029H05K2201/068B32B15/08B32B27/30H05K1/03B32B15/20B32B27/20B32B15/082
Inventor 改森信吾山内雅晃冈本健太郎木谷聪志村田和夫
Owner SUMITOMO ELECTRIC IND LTD
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