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High-transparency LED die bond adhesive and preparation method thereof

A high-transparency, crystal-bonding technology, applied in the fields of electronic chemicals and polymer science, can solve the problem of low light extraction efficiency of chips, achieve the effects of good thixotropy, improve efficiency, and improve shear strength

Inactive Publication Date: 2019-07-23
矽时代材料科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, for power LEDs to be more widely used, the key is to increase their luminous efficiency and luminous flux to the level of existing lighting sources, and the biggest obstacle for power LEDs to obtain high luminous flux is still the low light extraction efficiency of the chip.

Method used

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  • High-transparency LED die bond adhesive and preparation method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0055] As an embodiment of a high-transparency LED crystal-bonding adhesive of the present invention, the LED crystal-bonding adhesive includes the following components by weight: 200 g of phenylvinyl silicone resin, 40 g of phenylhydrogen silicone resin, inhibitor (methyl 0.06 g of ethynyl alcohol), 0.32 g of a methylvinylsiloxane-coordinated platinum catalyst, 4.8 g of a binder (allyl glycidyl ether), and 16 g of fumed silica.

[0056] The refractive index of the phenylvinyl silicone resin is 1.44, the refractive index of the phenylhydrogen silicone resin is 1.44, the platinum content of the platinum catalyst is 3000ppm, and the fumed silica is Wacker H30.

[0057] The preparation method of the LED crystal-bonding glue of the present embodiment comprises the following steps:

[0058] (1) Preparation of phenyl vinyl silicone resin:

[0059] (1a) Add 100g of trimethylchlorosilane, 100g of methyltriethoxysilane, 40g of phenyltrichlorosilane, 300g of tetraethyl orthosilicate, 1...

Embodiment 2

[0073] As an embodiment of a high-transparency LED crystal-bonding adhesive of the present invention, the LED crystal-bonding adhesive includes the following components by weight: 200 g of phenylvinyl silicone resin, 45 g of phenylhydrogen silicone resin, inhibitor (methyl 0.06 g of ethynyl alcohol), 0.33 g of a methylvinylsiloxane-coordinated platinum catalyst, 5 g of a binder (allyl glycidyl ether), and 16 g of fumed silica.

[0074] The refractive index of the phenylvinyl silicone resin is 1.46, the refractive index of the phenylhydrogen silicone resin is 1.46, the platinum content of the platinum catalyst is 3000ppm, and the fumed silica is Wacker H30.

[0075] The preparation method of the LED die-bonding adhesive of the present embodiment comprises the following steps:

[0076] (1) Preparation of styrene-based silicone resin:

[0077] (1a) Add 100g of trimethylchlorosilane, 70g of methyltriethoxysilane, 60g of phenyltrichlorosilane, 310g of ethyl orthosilicate, 100g of ...

Embodiment 3

[0091] As an embodiment of the high-transparency LED crystal-bonding adhesive of the present invention, the LED crystal-bonding adhesive includes the following components by weight: 200 g of phenylvinyl silicone resin, 42 g of phenylhydrogen-based silicone resin, inhibitor (methylethynyl Alcohol) 0.06 g, methyl vinyl siloxane-coordinated platinum catalyst 0.33 g, binder (allyl glycidyl ether) 5 g, and fumed silica 16 g.

[0092] The refractive index of the phenylvinyl silicone resin is 1.47, the refractive index of the phenylhydrogen silicone resin is 1.47, the platinum content of the platinum catalyst is 3000ppm, and the fumed silica is Wacker H30.

[0093] The preparation method of the LED die-bonding adhesive of the present embodiment comprises the following steps:

[0094] (1) Preparation of styrene-based silicone resin

[0095] (1a) Add 100g of trimethylchlorosilane, 50g of methyltriethoxysilane, 90g of phenyltrichlorosilane, 330g of tetraethyl orthosilicate, 100g of but...

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Abstract

The invention discloses a high-transparency LED die bond adhesive and a preparation method thereof. The LED die bond adhesive is prepared from components in parts by weight as follows: 100 parts of asilicon polymer containing vinyl, 15-25 parts of a silicon polymer containing silicon-hydrogen bonds, 0.1-0.8 parts of a catalyst, 0.01-0.1 parts of an inhibitor, 2-6 parts of an adhesive and 3-9 parts of fumed silica. The material is an organosilicon material with medium refractive index, has the characteristics of high transparency, high shear strength, better thixotropy, excellent ultraviolet aging resistance and the like and is an ideal LED die bond material.

Description

technical field [0001] The invention relates to the technical fields of electronic chemicals and polymers, in particular to a high-transparency LED crystal-bonding adhesive and a preparation method thereof. Background technique [0002] With the advancement of science and technology and the development of society, people's awareness of resource shortages and environmental pollution has gradually increased. In order to achieve the goal of sustainable social and economic development, my country has invested a lot of manpower, financial and material resources in the fields of energy conservation and environmental protection. Lighting consumption As a large energy consumer, it consumes a large amount of electric energy every year. Therefore, it is necessary to develop and use more energy-saving and environmentally friendly lighting methods. LED has the characteristics of power saving, long life, and environmental protection. It has achieved rapid development in recent years. In th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/07C09J183/05C09J11/04H01L33/56C08G77/20C08G77/12
CPCC08G77/12C08G77/20C08L2201/10C08L2203/206C09J11/04C09J183/04H01L33/56C08L83/04C08K7/26
Inventor 易太生
Owner 矽时代材料科技股份有限公司
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