Slot cleaning agent for anti-welding developing of circuit boards

A circuit board and anti-soldering technology, which is applied in the preparation of detergent compositions, non-surface-active detergent compositions, detergent mixture compositions, etc., can solve the problem of incomplete removal of metal scabs and unsatisfactory cleaning effect , Chlorine odor and other problems, to achieve the effect of low cost, low odor, and less chemical substances

Inactive Publication Date: 2019-07-23
广州恒荣电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the current cleaning agents for etching tanks often have unsatisfactory cleaning effects, and cannot completely remove metal sc

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0015] Example 1

[0016] A bath cleaning agent for solder resist development of circuit boards includes the following mass percentages of raw materials: sodium hydroxide 10%, ethanolamine 3%, trisodium phosphate 2%, and the balance is water.

[0017] The preparation method of the above-mentioned groove cleaning agent: adding the above-mentioned components into water and mixing them evenly to obtain a groove cleaning agent for solder resist development of circuit boards.

Example Embodiment

[0018] Example 2

[0019] A slot cleaning agent for solder resist development of circuit boards includes the following mass percentages of raw materials: sodium hydroxide 9%, ethanolamine 2%, trisodium phosphate 1.5%, and the balance is water.

[0020] The preparation method of the above-mentioned groove cleaning agent: adding the above-mentioned components into water and mixing them evenly to obtain a groove cleaning agent for solder resist development of circuit boards.

Example Embodiment

[0021] Example 3

[0022] A slot cleaning agent for solder resist development of circuit boards includes the following mass percentages of raw materials: sodium hydroxide 11%, ethanolamine 4%, trisodium phosphate 2.5%, and the balance is water.

[0023] The preparation method of the above-mentioned groove cleaning agent: adding the above-mentioned components into water and mixing them evenly to obtain a groove cleaning agent for solder resist development of circuit boards.

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PUM

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Abstract

The invention discloses a slot cleaning agent for anti-welding developing of circuit boards. The slot cleaning agent comprises the following raw materials by weight percent: 9-11% of sodium hydroxideand/or potassium hydroxide, 2-4% of one or more of ethanol amine, diethanol amine and triethanolamine, 1.5-2.5% of trisodium phosphate and/or sodium tripolyphosphate and the balance of water. A preparation method thereof comprises the following steps: adding all the components into water and then mixing till the mixture is uniform, thereby acquiring the slot cleaning agent. Few chemical substancesare used in the formula of the slot cleaning agent provided by the invention and the cost is low; the cleaning effect is excellent; the slot cleaning agent is capable of cleaning metallic sludge scabby substances attached to slot walls, pipelines, nozzles, and the like; the slot cleaning agent has slight smell and meets the requirement for green and environmental protection.

Description

technical field [0001] The invention relates to the field of cleaning agents for circuit boards, in particular to a cleaning agent for circuit board solder resist and development. Background technique [0002] Circuit boards are very important components in electronic products. Today, with the rapid development of electronic products, the demand for circuit boards is huge. During the mid-production process of circuit boards, solder mask work is required, including the development step. The existing technology mainly uses sodium carbonate developing solution. Since the tank solution contains a large amount of carbonate, solid precipitation will occur when combined with calcium and magnesium ions in the water. This white precipitation not only adheres to the tank wall, but also blocks the pipeline and nozzles. It is difficult to accumulate over time. If it is completely removed, it is easy to cause problems such as poor development / etching, etc. In severe cases, it will reduc...

Claims

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Application Information

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IPC IPC(8): C11D7/60C11D7/06C11D7/32C11D7/16C11D11/00
CPCC11D7/06C11D7/16C11D7/3218C11D11/0023C11D11/0041
Inventor 李华
Owner 广州恒荣电子科技有限公司
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