Circuit board and manufacturing method thereof

Abstract

Disclosed is a circuit board. The circuit board comprises a substrate, wherein the substrate has at least one first surface, and the circuit board further comprises a conductive body and a nickel layer, wherein the conductive body is combined with the first surface, and the nickel layer wraps the surface of the conductive body; the circuit board further comprises a non-metal conductive film and agold layer; the non-metal conductive film is combined on the first surface and is arranged adjacent to the nickel layer; and the gold layer wraps the nickel layer and the non-metal conductive film atthe same time. A dense protection interface formed by combining the gold layer and the non-metal conductive film is formed on the side surface, close to the substrate, of the nickel layer in the circuit board, so that corrosive gas can be effectively prevented from entering a gap between the nickel layer and the substrate, a nickel-gold interface and a nickel-copper interface can be effectively prevented from forming an original battery effect, and therefore the nickel layer and the electric conductor can be prevented from being corroded due to the original battery effect, and the gold layer can be effectively prevented from being stripped off. In addition, the invention further provides a manufacturing method of the circuit board.

Description

technical field [0001] The invention relates to a circuit board and a manufacturing method of the circuit board. Background technique [0002] At present, the use of circuit boards is becoming more and more widespread. The surface of the circuit board is generally provided with plating layers such as nickel-gold layer and palladium-gold layer. After the circuit board is manufactured, in order to verify the quality of the circuit board, it is generally necessary to conduct a corrosion resistance test on its coating. The types of corrosion resistance tests commonly used are: salt spray resistance test, sulfur dioxide (SO 2 ) gas test, resistance to nitric acid vapor test, resistance to hydrogen sulfide (H 2 S) Gas test, resistance to hydrogen sulfide gas mixed with other gases, etc. Test times vary from 24 hours to 1000 hours. [0003] In the process of plating nickel gold or nickel gold on the surface of the conductive line or pad of the circuit board, due to the deposit...

AI Technical Summary

Problems solved by technology

[0003] In the process of plating nickel gold or nickel gold on the surface of the conductive line or pad of the circuit board, due to the deposition of the coating on the surface of the line, and the insufficient exchange capacity of the liquid on the side and bottom of the line, the communication between the coating and the interlayer cannot be guaranteed. Density

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