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A kind of roughening fluid for surface treatment of diamond/copper composite material

A composite material and surface treatment technology, which is applied in metal material coating process, liquid chemical plating, coating, etc., can solve the problems of missed plating, poor bonding force and heat resistance in subsequent processes, and achieve smooth and bonded nickel coating Good strength and heat resistance, good roughening effect

Active Publication Date: 2021-01-22
SHENZHEN RUN SUN CHEM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0016] A new roughening solution effectively roughens the surface of diamond / copper composite materials, which solves the traditional roughening problems caused by missing plating in the follow-up process and poor brightness, bonding force and heat resistance of the coating (nickel / gold), etc. question

Method used

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  • A kind of roughening fluid for surface treatment of diamond/copper composite material
  • A kind of roughening fluid for surface treatment of diamond/copper composite material
  • A kind of roughening fluid for surface treatment of diamond/copper composite material

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Embodiment 1

[0050] Solution components, wherein liquid A consists of:

[0051] Potassium hydroxide, 20g / L;

[0052] Copper sulfate, 15g / L;

[0053] Potassium permanganate, 5g / L;

[0054] Potassium hypophosphite, 1g / L;

[0055] Triethanolamine, 8ml / L;

[0056] The balance, pure water.

[0057] Configuration method:

[0058] a. take by weighing 20g potassium hydroxide and dissolve in 800ml water, fully stir and mix evenly, obtain uniform potassium hydroxide solution;

[0059] b. Add 15g of anhydrous copper sulfate to the above potassium hydroxide solution, mix and stir evenly;

[0060] c. Add 5g potassium permanganate to the above mixed solution, mix and stir evenly;

[0061] d. Add 1g of potassium hypophosphite to the above mixed solution, mix and stir evenly;

[0062] e. Add 8ml triethanolamine to the above mixed solution, mix and stir evenly;

[0063] f. Add pure water to the above mixed solution, set the volume to 1L, mix and stir evenly, and set aside.

[0064] The compositio...

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Abstract

The invention provides a roughening solution applied to surface treatment of a diamond / copper semiconductor composite material, relates to a roughening solution applied to surface treatment and aims to solve the problem of nonuniformity of roughening of the conventional roughening solution. The roughening solution comprises a solution A for etching diamond and a solution B for etching copper. Theroughening solution has the beneficial effects that compared with the conventional roughening process, the material obtained after carrying out roughening treatment on the surface of the diamond / copper semiconductor composite material by using a new roughening solution has a better roughening effect, and the electroplated nickel-gold plating layer is smooth and bright, and is excellent in bindingforce and heat resistance.

Description

technical field [0001] The invention relates to a roughening solution for surface treatment, in particular to a roughening solution for surface treatment of diamond / copper composite materials. Background technique [0002] Diamond / copper composite material is a composite material made of diamond with high thermal conductivity, low expansion and copper with good thermal conductivity, which is insoluble in each other and can exert the characteristics of each component. It has many advantages in preparing new microelectronic packaging materials. It can replace materials such as Cu, W-Cu, Al / SiC and AlN which are widely used at present, and has a wide range of applications in various microwave diodes, integrated circuit bases and mobile phones. However, due to the introduction of diamond, the diamond / copper material has poor weldability. Although it has certain strength, thermal conductivity and matching thermal expansion coefficient, as a packaging material, the diamond / copper ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23F1/18C23C18/18
CPCC23C18/1834C23C18/1882C23F1/18
Inventor 罗琳姚郑军刘晓芳王蕊万涛明杨红
Owner SHENZHEN RUN SUN CHEM TECH