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Novel foil producing device for electrolytic copper foil and preparation method of cathode roller

A technology of electrolytic copper foil and cathode roller, which is applied in the direction of electrolysis process, electroforming, metal material coating process, etc., can solve the problems affecting the yield rate of copper foil, etc., and achieve the effect of solving easy breakage and eliminating pinholes

Active Publication Date: 2019-07-26
FUJIAN QINGJING COPPER FOIL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing 6μm and below electrolytic copper foil will form pinholes on the surface of the copper foil during the production process, which will affect the yield of copper foil production

Method used

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  • Novel foil producing device for electrolytic copper foil and preparation method of cathode roller
  • Novel foil producing device for electrolytic copper foil and preparation method of cathode roller
  • Novel foil producing device for electrolytic copper foil and preparation method of cathode roller

Examples

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Effect test

preparation example Construction

[0051] Please refer to Figure 7 , the present invention also provides a preparation method of electrolytic copper foil, comprising the following steps:

[0052] S4, copper sulfate electrolyte configuration: heat and dissolve high-purity copper wires with a purity of 99.95% and above in sulfuric acid solution to generate copper sulfate electrolyte;

[0053] S5, raw foil manufacturing; add additives to the copper sulfate electrolyte, and transport it to the electrolytic cell of the foil machine for electrolytic raw foil, wherein; the process parameters of electrolytic raw foil are: the temperature of the electrolytic solution is controlled at 50-60 °C, the current density of the anode plate 12 during the foil production process is 38-45A / dm 2 , Cu 2+ Concentration is 90~95g / L, H 2 SO 4 Concentration is 100-110g / L, gelatin concentration is 100-300ppm, ceric sulfate concentration is 0.5-10ppm, MESS concentration is 1-20ppm, SPS concentration is 10-50ppm, Cl - The concentrati...

Embodiment

[0066] Example: heating and dissolving a high-purity copper wire with a purity of 99.95% in a sulfuric acid solution to form a copper sulfate electrolyte; adding additives to the copper sulfate electrolyte, and transporting it to the electrolytic cell of a foil production machine for electrolytic foil production. Among them; the process parameters of electrolytic raw foil are: the temperature of the electrolyte is controlled at 58 ° C, Cu 2+ Concentration is 94g / L, H 2 SO 4 Concentration is 106g / L, gelatin concentration is 150ppm, ceric sulfate concentration is 4ppm, MESS concentration is 12ppm, SPS concentration is 25ppm, Cl - The concentration is 28ppm; copper foils of 4 microns, 4.5 microns, 5 microns and 6 microns are respectively obtained by controlling the current density of the anode plate during the foil production process. The test data of various copper foils are as follows:

[0067]

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Abstract

The invention provides a novel foil producing device for an electrolytic copper foil. The novel foil producing device for the electrolytic copper foil comprises a foil producing machine anode unit (10) which is electrically connected with a positive electrode and a cathode roller (20) which is electrically connected with a negative electrode, wherein the cathode roller (20) comprises a roller surface (21) which is used for producing the foil and edge portions (22) which are arranged on the two sides of the roller surface (21), the surface roughness of the roller surface (21) meets the following requirements that Ra is less that 0.2 mm, Rz is less than 1.5 mm, and the edge portions (22) are formed by performing oxidation treatment through hydrogen peroxide.

Description

technical field [0001] The invention relates to a novel electrolytic copper foil raw foil device and a preparation method of a cathode roller. Background technique [0002] At present, copper foil is an indispensable and important basic material for the electronics industry. Especially with the further upgrading of the new energy industry, electrolytic copper foil of 6 μm and below has a broader market prospect, and the quality requirements for electrolytic copper foil of 6 μm and below are also increasing. come higher. However, pinholes will be formed on the surface of the copper foil during the production process of the existing 6 μm and below electrolytic copper foil, which will affect the yield of the copper foil production. Contents of the invention [0003] The invention provides a novel electrolytic copper foil production device, which can effectively solve the above problems. [0004] The present invention is achieved like this: [0005] A new foil production de...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D1/04C23C22/54B24B1/00
CPCB24B1/00C23C22/54C25D1/04
Inventor 贾永良宋铁峰陈亮龙郭贵龙郭小高黄耀辉
Owner FUJIAN QINGJING COPPER FOIL
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