UV curable epoxy system organic packaging composition, preparation method and use method thereof

An epoxy system and composition technology, applied in the field of organic films, can solve the problems that the film is difficult to meet the requirements of packaging materials, the internal stress of a single epoxy cured product is large, and the volume shrinkage rate is small, so as to improve thermal performance and hydrophobicity. , strong deformation ability, and high product purity

Inactive Publication Date: 2019-08-16
XIAN SMART MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The reason is mainly due to the phenomenon of oxygen-free polymerization inhibition of the epoxy system, small volume shrinkage, high adhesion, low cost and excellent mechanical properties. Unstable, which makes it difficult for a single epoxy system film to meet the requirements of encapsulation materials

Method used

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  • UV curable epoxy system organic packaging composition, preparation method and use method thereof
  • UV curable epoxy system organic packaging composition, preparation method and use method thereof
  • UV curable epoxy system organic packaging composition, preparation method and use method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment a

[0045] The preparation method of the silicon-based epoxy A of the present embodiment may further comprise the steps:

[0046] 1a) Weigh the hydrogen-containing siloxane and solvent into the beaker, stir it with a glass rod to make it evenly mixed, then blow nitrogen into it for 5-10 minutes, and finally add it into the three-necked flask, and carry out under nitrogen atmosphere Constant temperature magnetic stirring;

[0047] 2a) Then weigh the vinyl epoxy monomer and the catalyst, mix them uniformly and drop them into the solution in 1a), the dropping time is 20-40min;

[0048] 3a) After the dropwise addition reaction is completed, the reaction temperature is increased, and stirred under constant temperature reflux under a nitrogen atmosphere. After the reaction is completed, solvent removal treatment is performed to finally obtain a light yellow viscous liquid. Wherein, the mass ratio of vinyl epoxy, hydrogen-containing siloxane, catalyst and solvent is 100:15:1:150.

[00...

Embodiment b

[0054] In the present embodiment, the preparation method of silicon-based epoxy A comprises the following steps:

[0055] 1a) Weigh the hydrogen-containing siloxane and solvent into the beaker, stir it with a glass rod to make it evenly mixed, then blow nitrogen into it for 5-10 minutes, and finally add it into the three-necked flask, and carry out under nitrogen atmosphere Constant temperature magnetic stirring;

[0056] 2a) Then weigh the vinyl epoxy monomer and the catalyst, mix them uniformly and drop them into the solution in 1a), the dropping time is 20-40min;

[0057] 3a) After the dropwise addition reaction is completed, the reaction temperature is increased, and stirred under constant temperature reflux under a nitrogen atmosphere. After the reaction is completed, solvent removal treatment is performed to finally obtain a light yellow viscous liquid.

[0058] Wherein, the mass ratio of vinyl epoxy, hydrogen-containing siloxane, catalyst and solvent is 100:50:0.05:200...

Embodiment c

[0064] The preparation method of silicon-based epoxy A in the present embodiment comprises the following steps:

[0065] 1a) Weigh the hydrogen-containing siloxane and solvent into the beaker, stir it with a glass rod to make it evenly mixed, then blow nitrogen into it for 5-10 minutes, and finally add it into the three-necked flask, and carry out under nitrogen atmosphere Constant temperature magnetic stirring;

[0066] 2a) Then weigh the vinyl epoxy monomer and the catalyst, mix them uniformly and drop them into the solution in 1a), the dropping time is 20-40min;

[0067] 3a) After the dropwise addition reaction is completed, the reaction temperature is increased, and stirred under constant temperature reflux under a nitrogen atmosphere. After the reaction is completed, solvent removal treatment is performed to finally obtain a light yellow viscous liquid.

[0068] Wherein, the mass ratio of vinyl epoxy, hydrogen-containing siloxane, catalyst and solvent is 100:25:5:180.

...

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Abstract

The invention discloses a UV curable epoxy system organic packaging composition, a preparation method and a use method thereof, wherein the organic packaging composition comprises, by weight, 10-90% of silicon-based epoxy, 10-90% of non-silicon-based epoxy, 5-40% of a diluent, 0.5-10% of a photoinitiator, and 0.5-10% of a photosensitizer, wherein the non-silicon-based epoxy is a one or a mixture comprising two selected from bifunctional epoxy and polyfunctional epoxy, and the diluent is aromatic or aliphatic non-silicon-based monoepoxy. According to the present invention, the UV curable epoxysystem organic packaging composition can achieve the organic packaging film with advantages of high light transmittance, high curing rate, high adhesion, small volume yield, no oxygen inhibition and dark reaction.

Description

technical field [0001] The invention belongs to the technical field of organic thin films, and relates to an organic thin film package, in particular to a UV-curable epoxy system organic package composition and a preparation and use method thereof. Background technique [0002] With the development of science and technology, the upgrading of electronic products is also changing with each passing day. Many display devices have also changed from bulky and rigid to thin, foldable and bendable. Part of the performance and life of the display device is determined by its own characteristics, and the other part is guaranteed and extended by the external packaging protection. In the traditional packaging technology, the substrate used is rigid material (such as: steel plate, acrylic, glass, ceramics and other hard materials), so it lacks certain flexibility and cannot fully meet the market demand. The thin film packaging technology (TFE ) appeared to solve this problem just right. ...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08G59/30
CPCC08G59/306C08L63/00C08L2203/206C08L2205/025
Inventor 刘育红吴朝新吉静茹张弛
Owner XIAN SMART MATERIALS CO LTD
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