Wide-stop-band noise suppression structure applied to power distribution network in system-in-package and intelligent optimization design method of wide-stop-band noise suppression structure

A power distribution network, system-level packaging technology, applied in special data processing applications, computing, electrical digital data processing, etc., can solve problems such as difficult to optimize design, long design cycle, low efficiency of noise suppression structure, etc. Integrity, resolving inefficiencies, increasing surface impedance effects

Active Publication Date: 2019-08-20
ANHUI UNIVERSITY
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  • Abstract
  • Description
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Problems solved by technology

[0007] The purpose of the present invention is to solve the defects of low efficiency, long design period and difficulty in optimal design of the noise suppression structure in the prior art, and provide a wide stopband noise suppression structure and its intelligent Optimal design method to solve the above problems

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  • Wide-stop-band noise suppression structure applied to power distribution network in system-in-package and intelligent optimization design method of wide-stop-band noise suppression structure
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  • Wide-stop-band noise suppression structure applied to power distribution network in system-in-package and intelligent optimization design method of wide-stop-band noise suppression structure

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Embodiment Construction

[0058] In order to have a further understanding and understanding of the structural features of the present invention and the achieved effects, the preferred embodiments and accompanying drawings are used for a detailed description, as follows:

[0059] Such as figure 1 As shown, a wide stopband noise suppression structure applied to a power distribution network in a system-in-package according to the present invention includes a dielectric substrate 101, and a metal ground plane is printed on the back of the dielectric substrate 101 (the back is a complete ground plane), Guarantee its signal integrity.

[0060] The front side of the dielectric substrate 101 is printed with a power distribution network, the power distribution network includes an electromagnetic bandgap structure, the number of which is 9, and the electromagnetic bandgap structure is arranged on the dielectric substrate 101 in a traditional "3×3" form .

[0061] Such as figure 2 As shown, the electromagneti...

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Abstract

The invention relates to a wide-stop-band noise suppression structure applied to a power distribution network in system-in-package and an intelligent optimization design method thereof. Compared withthe prior art, the defects that the noise suppression structure is low in efficiency, long in design period and difficult to optimize the design are overcome. According to the invention, a rectangulararea is divided on a device bearing copper plate; wherein the four sides of the rectangular area are composed of 72 rectangular blocks, the areas of the 72 rectangular blocks are the same, the transverse side of the rectangular area is formed by 20 rectangular blocks which are regularly arranged in two rows, the vertical side of the rectangular area is formed by 16 rectangular blocks which are regularly arranged in two columns, and a plurality of rectangular blocks are etched into a hollow structure. The shape of the electromagnetic band gap structure is designed on the power layer of the power distribution network, so that the noise suppression low-frequency cut-off frequency is reduced, and the noise suppression frequency bandwidth range is increased; the size of the distribution network is automatically optimized through an automatic optimization method, and the noise suppression depth is increased.

Description

technical field [0001] The invention relates to the technical field of power distribution network in system-level packaging, and specifically relates to a wide stopband noise suppression structure and an intelligent optimization design method applied to the power distribution network in system-level packaging. Background technique [0002] With the development of electronic systems towards high speed, high power consumption, high density, low voltage and high current, in future hybrid circuit systems, high-speed digital processors, memories, radio frequency (RF) / analog circuits, sensors, Integration of multi-functional devices such as micro-electro-mechanical systems (MEMS), optoelectronic devices, etc. This kind of micro-system integration also requires communication and computing capabilities. System-in-package (SOP) technology provides the most effective solution for package-chip co-design, and has become one of the trends in the development of microelectronics technology...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
CPCG06F30/39G06F30/367G06F2113/18G06F2115/06G06F2119/10Y02E60/00
Inventor 朱浩然王家宝孙玉发
Owner ANHUI UNIVERSITY
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