Preparation process of aluminum oxide dispersion strengthened copper alloy
A dispersion-strengthened copper and preparation process technology, applied in metal processing equipment, transportation and packaging, etc., can solve the problems of poor performance stability, complicated preparation process, long process, etc., achieve stable performance, simplify the preparation process, and reduce the sintering temperature Effect
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Example Embodiment
[0015] Specific embodiment one
[0016] A preparation process of aluminum oxide dispersion-strengthened copper alloy, comprising the following steps:
[0017] Step 1: put the alumina-dispersed copper alloy raw material powder into the ball milling equipment for ball-milling treatment to obtain alloy powder with uniform distribution and good sintering performance;
[0018] Step 2: The alumina dispersion strengthened copper alloy is prepared by hot pressing and sintering the raw material powder treated by ball milling in Step 1.
[0019] Further, the components of the alumina-dispersed copper alloy raw material powder in step 1 are alumina and copper, wherein the mass percentage of alumina is 0.10%-30.00%, and the balance is copper.
[0020] Further, the average grain size of the alumina-dispersed copper alloy raw material powder in step 1 is 5-150um.
[0021] Further, the ball-to-material ratio of the ball-milling treatment in step 1 is 10:1-10:8, and the ball-milling time is...
Example Embodiment
[0023] Example 1
[0024] Preparation of a dispersion-strengthened copper alloy with an alumina content of 0.20%: the average particle size of the powder is 10um of alumina-dispersed copper alloy powder for ball milling. The ball-milled alloy powder is hot-pressed and sintered, and the hot-pressed sintering process is as follows: the degree of vacuum is 10 -1 MPa, the sintering pressure is 50MPa, the hot pressing temperature is 900°C, the heating rate is 10°C / min, the holding time is 30min, and then the temperature is lowered and cooled to room temperature to obtain an alumina dispersion-strengthened copper alloy. The density of the alumina dispersion strengthened copper alloy was determined to be 8.95g / cm 3 , the electrical conductivity is 85% IACS, and the room temperature tensile strength is 530MPa.
Example Embodiment
[0025] Example 2
[0026] The preparation of a dispersion-strengthened copper alloy with an alumina content of 0.40%: the alumina-dispersed copper alloy powder with an average particle size of 30um is used for ball-milling treatment. The ball-milled alloy powder is hot-pressed and sintered, and the hot-pressed sintering process is as follows: the degree of vacuum is 10 -2 MPa, the sintering pressure is 70MPa, the hot pressing temperature is 930°C, the heating rate is 15°C / min, the holding time is 60min, and then the temperature is lowered and cooled to room temperature to obtain an alumina dispersion-strengthened copper alloy. The density of the alumina dispersion strengthened copper alloy was determined to be 8.94g / cm 3 , the electrical conductivity is 83% IACS, and the room temperature tensile strength is 550MPa.
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