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Low alpha epoxy molding compound and preparation method thereof

A technology of epoxy molding compound and epoxy resin, applied in low alpha epoxy molding compound, preparation of epoxy molding compound, epoxy molding compound field, can solve the problems of device deterioration, instant failure, missile runaway and the like

Inactive Publication Date: 2019-09-03
HENKEL HUAWEI ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although soft errors occur randomly, they can lead to failures such as device degradation or instantaneous failure, which can have serious consequences for devices in some key application areas
For example, the integrated circuit chips used in missiles may cause system logic errors after being irradiated by rays, making the missiles out of control
Or if the integrated circuits installed in nuclear power plants, nuclear submarines and other equipment are radiated by radiation, it may lead to loss of control of equipment

Method used

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  • Low alpha epoxy molding compound and preparation method thereof
  • Low alpha epoxy molding compound and preparation method thereof
  • Low alpha epoxy molding compound and preparation method thereof

Examples

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preparation example Construction

[0084] The present invention also relates to the preparation method of epoxy molding compound, it comprises the following steps:

[0085] (1) each component is weighed and mixed to obtain a premixed powder,

[0086] (2) Heat and mix the premixed powder and extrude to obtain the product;

[0087] Wherein the temperature of heating in step (2) is about 90-120 ℃.

[0088] Wherein the step (1) also includes the step of cleaning the equipment used to prepare the epoxy molding compound. Cleaning is called A-level cleaning. After the equipment used in the preparation of epoxy molding compound is disassembled, it is moved to the soot blowing room for cleaning, and after the cleaning is completed, ensure that there is no dust, accumulated material, or solidified material inside the equipment. Cleaning includes brushing to remove solids such as dust, build-up, solidified material, etc. in the equipment, and / or wiping the equipment with acetone. Cleaning includes cleaning the equipmen...

Embodiment

[0118] The present invention is described in further detail with reference to the following examples, which are not intended to limit the scope of the present invention. All numbers in the examples are expressed as parts by weight.

[0119] raw material

[0120] Epoxy resin: biphenyl type epoxy resin, viscosity at 150°C is about 0.2 poise, epoxy equivalent is 190g / eq, purchased from Mitsubishi, generally has the following structure

[0121]

[0122] Multi-functional epoxy resin, the epoxy equivalent is 160g / eq, purchased from Kayaku, generally has the following structure

[0123]

[0124] Phenolic resin: multifunctional phenolic resin with a softening point of 110°C, purchased from Minghe, generally has the following structure

[0125]

[0126] Curing accelerator: imidazole compound, purchased from SHIKOKU;

[0127] Filler: spherical silica A, alpha value 0.00864 counts per hour -1 ·cm -2 , with a uranium content of 0.5ppb, a sphericity of 0.89, and a particle ...

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Abstract

The invention relates to an epoxy molding compound, which comprises (a) epoxy resin, (b) phenolic resin, (c) a curing accelerator, and (d) an inorganic filler. The inorganic filler comprises sphericalsilica with an alpha value of 0.015.hours<-1> cm<-2> or less. The invention also relates to a preparation method and application of the epoxy molding compound.

Description

technical field [0001] The invention relates to the technical field of electronic chip packaging, in particular to an epoxy molding compound, especially a low alpha epoxy molding compound. The invention also relates to the preparation method and use of the epoxy molding compound. Background technique [0002] With the rapid development of integrated circuit technology, the "soft errors" of integrated circuit performance induced by alpha particles have attracted people's attention. Generally, soft errors refer to errors caused by bombarding chips with high-energy particles. Although soft errors occur randomly, they can lead to failures such as device degradation or transient failure, which have serious consequences for devices in some key application fields. For example, the integrated circuit chips used in missiles may cause system logic errors after being irradiated by rays, making the missiles out of control. Or if the integrated circuits installed in nuclear power plan...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08K13/04C08K7/18
CPCC08L63/00C08L2203/206C08L2205/025C08L2205/03C08K13/04C08K7/18
Inventor 范朗梅胡杰王柱金松牟海燕余伟
Owner HENKEL HUAWEI ELECTRONICS
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