Preparation method of graphene heat dissipating fin

A technology of graphene and heat sink, which is applied in the field of preparation of high thermal conductivity graphene heat sink, can solve the problems of high cost and difficult preparation, and achieve the effects of easy control, heat conduction penetration, and high product purity

Pending Publication Date: 2019-09-20
DONGXU OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Graphene is the thinnest and hardest nanomaterial known in the world. It is almost completely transparent and only absorbs 2.3% of light; it has excellent thermal conductivity, and the thermal conductivity of defect-free single-layer graphene is higher than that of carbon. Nanotubes and diamonds are carbon materials with the highest thermal conductivity so far, but their preparation is difficult and expensive

Method used

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  • Preparation method of graphene heat dissipating fin
  • Preparation method of graphene heat dissipating fin
  • Preparation method of graphene heat dissipating fin

Examples

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preparation example Construction

[0036] In a specific embodiment, refer to figure 1 , the preparation method of the graphene heat sink of the present invention comprises the following five steps: the first step, using graphene oxide and an aqueous solvent to prepare an aqueous graphene oxide solution; the second step, coating the aqueous graphene oxide solution on the substrate, and make it dry to obtain a graphene oxide film, and the graphene oxide film is peeled off from the substrate; in the third step, the graphene oxide film peeled off is irradiated with a laser, so that the graphene oxide is reduced , to obtain a graphene film; the fourth step, placing the graphene film in a carbonization furnace for carbonization; the fifth step, rolling the carbonized graphene film to obtain a graphene heat sink.

[0037] In a specific embodiment, the preparation process of the aqueous graphene oxide solution is as follows: adding graphite oxide to deionized water, then adding a dispersant, stirring, vibrating or ultr...

Embodiment 1

[0048] Add graphite oxide to deionized water, then add a dispersant, and stir, vibrate or sonicate to prepare an aqueous graphene oxide solution, wherein the graphene oxide sheet diameter is 90 μm, and the concentration of the graphene oxide solution is 0.5 mg / mL . The graphene oxide solution is coated on the substrate by means of transfer coating, and the graphene oxide film is obtained after drying, and the graphene oxide film is peeled off from the substrate. A high-energy laser with a wavelength of 788nm is used to irradiate the graphene oxide film to reduce the graphene oxide to obtain a graphene film. Put the graphene film above into a carbonization furnace, and carry out carbonization treatment at a temperature of 1250°C. The carbonized graphene film was rolled to obtain a graphene heat sink with a thickness of 10 μm. After testing, the obtained graphene heat sink has a horizontal thermal conductivity of 1928W / m·K.

Embodiment 2

[0050] Set the sheet diameter of graphene oxide to 50 μm, the concentration of graphene oxide solution to 1.5 mg / mL, the wavelength of high-energy laser to 418 nm, and the carbonization temperature to 1500 ° C to obtain a graphene composite heat sink Except that the thickness was set to 20 μm, a graphene heat sink was prepared in the same manner as in Example 1, and various evaluations were performed. After testing, the obtained graphene heat sink has a horizontal thermal conductivity of 1800W / m·K.

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Abstract

The invention discloses a preparation method of a graphene heat dissipating fin, which comprises the following steps: adding graphite oxide into deionized water, adding a dispersant, and preparing an aqueous graphene oxide solution by stirring, oscillating or ultrasonic wave; coating a substrate by the aqueous graphene oxide solution, drying the aqueous graphene oxide solution to obtain a graphene oxide film, and peeling the graphene oxide film off the substrate; irradiating the stripped graphene oxide film by laser to reduce graphene oxide to obtain a graphene film; placing the graphene film in a carbonization furnace for carbonization treatment; rolling the carbonized graphene film to obtain the graphene heat dissipating fin. The graphene heat dissipating fin having excellent heat dissipation performance can be prepared by reducing graphene oxide by laser and carbonizing the graphene oxide, and the process is easy to control and has high purity.

Description

technical field [0001] The invention relates to the technical field of heat dissipation materials for electronic products, in particular to a method for preparing a high thermal conductivity graphene heat sink. Background technique [0002] With the rapid development of modern technology, the miniaturization of electronic devices, the continuous increase of the main frequency of the chip, the increasing function, and the gradual increase of the power consumption of a single chip, all of these lead to a sharp increase in heat flux. For example, current electronic products such as mobile phones and computers have become the necessities of people's life. With the continuous upgrading of hardware, the calculation of the tasks it performs becomes more complex and cumbersome. Core components such as CPU and GPU will face heat problems. The main frequency of the chip increases and the power increases to generate a lot of heat. If the heat cannot be dissipated in time, It will caus...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C01B32/184
CPCC01B32/184C01B2204/24
Inventor 李青孙峰陈韵吉
Owner DONGXU OPTOELECTRONICS TECH CO LTD
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