Method for reducing content of residual silicone in SiCf/SiC composites prepared by infiltration process
A composite material and silicon content technology, which is applied in the field of ceramic matrix composite material preparation, can solve problems such as plugging holes, unfavorable infiltration reactions, and affecting high-temperature oxidation resistance of composite materials, and achieves simple formula, reduced residual silicon, and good chemical phase. capacitive effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0024] Step 1: Mix 20g of phenolic resin, 100g of ethanol, and 30g of TiC powder (5μm) and then ultrasonicate for 6 hours to make a mixed slurry;
[0025] Step 2: Brush the mixed slurry prepared in step 1 on the fiber two-dimensional fabric containing the SiC / BN composite interface layer, and let it dry at room temperature for 6 hours to make a prepreg. Wherein, the volume fraction of fiber two-dimensional fabric is 25%;
[0026] Step 3: Put the prepreg obtained in step 2 into a flat mold and use a hot press for hot pressing molding. The hot pressing temperature is 260°C, the pressure is 3 MPa, and the hot pressing time is 3 hours to obtain a preform;
[0027] Step 4: Carbonize the preform obtained in Step 3 at 850°C for 30 minutes in a nitrogen atmosphere to prepare a porous body;
[0028] Step 5: Modulate silicon powder (purity 99.5%) into a slurry with ethanol, use the method of brushing to make the slurry adhere to the surface of the porous body, and after drying at room ...
Embodiment 2
[0030] Step 1: Mix 40g of phenolic resin, 150g of acetone, and 32g of Ti powder (2 μm) and then ultrasonicate for 10 hours to make a mixed slurry;
[0031] Step 2: Brush the mixed slurry prepared in Step 1 on the fiber two-dimensional fabric containing the SiC / BN composite interface layer, and let it dry at room temperature for 12 hours to make a prepreg. Wherein, the volume fraction of fiber two-dimensional fabric is 30%;
[0032] Step 3: Put the prepreg obtained in step 2 into a flat mold and use a hot press for hot pressing molding. The hot pressing temperature is 280 ° C, the pressure is 4 MPa, and the hot pressing time is 4 hours to obtain a preform;
[0033] Step 4: Carbonize the preform obtained in Step 3 at 1100° C. for 30 minutes in a nitrogen atmosphere to prepare a porous body;
[0034] Step 5: Use ethanol to adjust the silicon powder (99.9% purity) into a slurry, and use the method of brushing to make the slurry adhere to the surface of the porous body. After dryi...
Embodiment 3
[0036] Step 1: Mix 60g of phenolic resin, 140g of toluene, 28g of TiC powder (5μm) and 8g of Ti powder (10μm) and ultrasonically 20h to make a mixed slurry;
[0037] Step 2: Brush the mixed slurry prepared in Step 1 on the fiber two-dimensional fabric containing the SiC / BN composite interface layer, and let it dry at room temperature for 72 hours to make a prepreg. Wherein, the volume fraction of fiber two-dimensional fabric is 28%;
[0038] Step 3: Put the prepreg obtained in step 2 into a flat mold and use a hot press for hot pressing molding. The hot pressing temperature is 310°C, the pressure is 10 MPa, and the hot pressing time is 6 hours to obtain a preform;
[0039] Step 4: Carbonize the preform obtained in Step 3 at 1400°C for 60 minutes in a nitrogen atmosphere to prepare a porous body;
[0040]Step 5: Use ethanol to adjust the silicon powder (purity: 99.5%) into a slurry, use the method of brushing to make the slurry adhere to the surface of the porous body, and aft...
PUM
Property | Measurement | Unit |
---|---|---|
particle diameter | aaaaa | aaaaa |
porosity | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com