Antenna preparation method using vacuum plating combined with laser process and 5G antenna

A laser process and vacuum plating technology, applied in the field of 5G antennas, can solve problems such as difficult high-precision production of 5G antennas, inability to play antenna performance, antenna resonance frequency deviation, etc., to achieve flexible and wide range of use, meet the requirements of transmitting and receiving performance, The effect of overcoming the deterioration of mechanical properties

Inactive Publication Date: 2019-09-27
INNETECH TIANJIN ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the sharp reduction in the size of the antenna, when processing and producing 5G antennas, the resonant frequency of the antenna will deviate a lot if the size is slightly deviated. At present, the traditional laser engraving and FPC process can only achieve an accuracy of about 0.15mm when producing antennas, and it is difficult to realize 5G antennas. High-precision production is required; in addition, because the FPC process is in 2D form, it is difficult to use various cutting surfaces on complex 3D composite surfaces, and it will not be able to exert the proper performance of the antenna due to the limitation of the antenna routing form, while the traditional laser engraving It is difficult to achieve metallization on the surface of the current mainstream mobile phone glass and ceramic back cover due to the limitation of laser wavelength and other reasons.

Method used

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  • Antenna preparation method using vacuum plating combined with laser process and 5G antenna
  • Antenna preparation method using vacuum plating combined with laser process and 5G antenna

Examples

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Effect test

Embodiment 1

[0032] refer to figure 1 , a method for preparing an antenna utilizing vacuum plating combined with a laser process, comprising the following steps:

[0033] Substrate surface cleaning treatment:

[0034] First, clean the surface of the plastic substrate 3 to keep the surface of the plastic substrate 3 clean, thereby improving the adhesion and smoothness of the metal coating. First, put the plastic substrate 3 into an alkaline solution at a temperature of 50°C for ultrasonic cleaning. Degrease and degrease, the time is 5 minutes, wash with pure water after completion, then put in 3% dilute sulfuric acid solution to neutralize the residual lye, time 5 seconds, finally rinse with pure water and dry;

[0035] S1: Metallization treatment on the surface of plastic substrate:

[0036] After the cleaning is completed, put the plastic substrate 3 into the vacuum ion coating machine of the pure copper target, seal the vacuum chamber, start the vacuum pump to pump the air pressure of ...

Embodiment 2

[0042] refer to figure 2 , a method for preparing an antenna utilizing vacuum plating combined with a laser process, comprising the following steps:

[0043] Substrate surface cleaning treatment:

[0044] First, clean the surface of the 2.5D or 3D glass back cover substrate 3' to keep the surface of the glass back cover clean, thereby improving the adhesion and smoothness of the metal coating. First, put the glass back cover into an alkaline solution at a temperature of 70°C Ultrasonic cleaning is carried out to degrease and degrease for 8 minutes. After completion, wash with pure water, then put it into 5% dilute sulfuric acid solution to neutralize the residual lye for 8 seconds, and finally rinse with pure water and dry ;

[0045] S1: Surface metallization of glass back cover substrate:

[0046] After the cleaning is completed, put the glass back cover substrate 3' into the magnetron sputtering coating machine of the pure copper target, seal the vacuum chamber, and start ...

Embodiment 3

[0052] Based on the foregoing solution, the substrate may also be a ceramic material.

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Abstract

The invention discloses an antenna preparation method using vacuum plating combined with a laser process and a 5G antenna. A base material can use a three-dimensional non-metal material as a carrier of an antenna product, and an antenna wire is processed by using laser, so that the metal layer of a spare part of the surface is removed to obtain a required three-dimensional antenna. The antenna preparation method combining vacuum plating with the laser technology comprises the following steps: S1, the metallization treatment on the surface of the base material: coating the surface of the base material with a metal layer through vacuum plating to obtain an antenna blank, wherein the base material is a three-dimensional non-metal material; S2, antenna routing processing: performing routing processing on the antenna blank obtained at the step S1 by using a laser etching process, removing the redundant metal layer on the surface of the antenna blank, and performing surface cleaning treatment on the base material before the step S1.

Description

technical field [0001] The invention relates to the field of mobile communications, in particular to an antenna preparation method and a 5G antenna using vacuum plating combined with a laser process. Background technique [0002] With the continuous development and progress of the mobile Internet, and the upcoming large-scale commercial use of the next-generation 5G mobile network, various mobile terminals have become indispensable in people's daily work and life. As a wireless communication tool, the signal strength of the mobile terminal determines the smoothness of the actual use of the mobile network to a large extent, and under the coverage of the base station under the same mobile network, the strength of the mobile terminal signal largely depends on the mobile terminal's signal strength. antenna. [0003] The 5G network requires high speed, which can only be achieved with a wider bandwidth than 4G, and to achieve wide bandwidth must make the carrier run at a higher f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01Q1/36H01Q1/38H01Q1/40C23C14/02C23C14/14C23C14/22C23C14/58
CPCC23C14/021C23C14/14C23C14/22C23C14/5873H01Q1/364H01Q1/38H01Q1/40
Inventor 王萌孙广亮杨丽刘冬生
Owner INNETECH TIANJIN ELECTRONICS
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