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Optical module

An optical module and optical technology, applied in the field of optical modules, can solve problems such as adverse effects of optical module operation, increased stray light intensity, and stray light.

Active Publication Date: 2019-10-01
FURUKAWA ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] On the other hand, inside an optical module such as a laser module, unnecessary light such as stray light that cannot be used for a specific application may be generated, which may adversely affect the operation of the optical module.
For example, if a photodiode (PD) for monitoring laser intensity is arranged inside the laser module to control the operation of the laser module, the monitoring accuracy may decrease due to stray light becoming noise and light input to the PD.
In particular, in high-output laser modules, the intensity of stray light also increases, so the drop in monitoring accuracy is more significant

Method used

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Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0044] Figure 1A ~ 1C It is a schematic diagram showing the configuration of a semiconductor laser module as an optical module according to the first embodiment. Such as Figure 1A As shown in the side view of , the semiconductor laser module 100 includes a case 1 having a cover 1a. In addition, if Figure 1B As shown in the state where the cover 1a is removed, the semiconductor laser module 100 has a submount 2, a laser element 3, a collimator lens 4, a beam splitter 5, an optical isolator 6, and a condenser lens arranged in the housing 1. 7. The sub-base 8 , the SOA 9 , the beam splitter 10 , the PD 12 supported on the PD carrier 11 , the etalon filter 13 and the PD 15 supported on the PD carrier 14 .

[0045] The housing 1 has a cover 1a, a bottom plate 1b, and a side wall portion 1c. On the side wall portion 1c on the right side of the drawing, there is provided a holder portion 1d for accommodating the condenser lens 16 and for inserting and fixing one end of the opti...

Embodiment approach 2

[0076] Figure 2A , 2B It is a schematic diagram showing the configuration of a semiconductor laser module as an optical module according to the second embodiment. A semiconductor laser module 100A according to Embodiment 2 has a structure in which case 1 in the structure of semiconductor laser module 100 according to Embodiment 1 is replaced with case 1A, and submount 8 is replaced with submount 8A. The case 1A has a structure in which the cover 1a of the case 1 is replaced with a cover 1Aa.

[0077] Figure 2A It is the figure which removed the state of cover 1Aa, Figure 2B It is a figure which shows the inner surface of cover 1Aa. Like the sub-mount 8 , the sub-mount 8A is made of a material having a high thermal conductivity such as alumina, aluminum nitride, boron nitride, copper, and silicon. Also, a part of the surface of the submount 8A, that is, a part of the area on both sides of the region where the SOA 9 is placed with respect to the traveling direction of th...

Embodiment approach 3

[0083] Figure 4 It is a schematic diagram showing the structure of a semiconductor laser module as an optical module according to Embodiment 3, and is a diagram in a state where a cover is removed. A semiconductor laser module 100B according to the third embodiment has a structure in which the case 1A in the structure of the semiconductor laser module 100A according to the second embodiment is replaced with a case 1B, and the submount 2 is replaced with a submount 2B. The case 1B has a structure in which the side wall portion 1c of the case 1A is replaced with a side wall portion 1Bc.

[0084] Like the sub-mount 2 , the sub-mount 2B is made of a material with high thermal conductivity such as alumina, aluminum nitride, boron nitride, copper, and silicon. Also, a part of the surface of submount 2B, that is, the rear side of the region where laser element 3 is placed (the side opposite to the output end of laser light L1 of laser element 3 ) becomes light reflection reduction ...

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Abstract

This optical module comprises a housing, and an optical element which is disposed inside the housing and which emits light inside the housing, wherein a region on one part of the inner surface of thehousing is a light reflection reduction region which absorbs the light and which has been treated so as to be a rough surface. The light reflection reduction region preferably constitutes the surfaceof the lid of the housing. The lid preferably includes a Fe-Ni-Co alloy or aluminum oxide. The surface underneath the light reflection reduction region of the lid is gold-plated, and the inner surfaceof the lid located around the light reflection reduction region is gold-plated.

Description

technical field [0001] The present invention relates to optical modules. Background technique [0002] Among laser modules used as light sources for communication, as disclosed in Patent Documents 1 to 3, there are laser modules that use an integrated semiconductor laser element that integrates a semiconductor laser and a semiconductor optical Output (see Patent Documents 1 to 3). In recent years, both semiconductor lasers and SOAs have been driven with high currents in order to achieve further higher output, and the heat generation of integrated semiconductor laser elements has increased. In this case, in the integrated semiconductor laser element, the amount of heat generated by the element increases, and it may be difficult to perform appropriate temperature adjustment (mainly by cooling) by the thermoelectric element. Therefore, a structure has been proposed in which a semiconductor laser and an SOA are separated as independent elements, and temperature adjustment is p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01S5/022G02B6/42
CPCH01S5/005H01S5/0064H01S5/02216H01S5/02415H01S5/0683H01S5/0687H01S5/50H01S2301/02G02B6/4271G02B6/4286G02B6/4206H01S5/02325H01S5/02251H01S5/02208H01S5/02438H01S5/02476H01S5/06817H01S5/02253
Inventor 有贺麻衣子石毛悠太岩间真木
Owner FURUKAWA ELECTRIC CO LTD