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Halogen-free low-temperature environment-friendly soldering paste for heat dissipation module and preparing method of halogen-free low-temperature environment-friendly soldering paste

A heat dissipation module and solder paste technology, which is applied to welding equipment, welding media, manufacturing tools, etc., can solve the problems of affecting welding quality, affecting use effect, and reducing welding reliability, so as to achieve good welding effect, improve use effect, The effect of ensuring welding quality

Inactive Publication Date: 2019-10-08
浙江强力控股有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The traditional low-temperature environmentally friendly solder paste contains halogen-containing active agents, which cause patina after soldering, which reduces the reliability of soldering and affects the use effect. welding quality

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] Embodiment 1, a halogen-free low-temperature environment-friendly solder paste for a heat dissipation module, including tin powder and flux, the proportion of the flux to the tin powder is 9.6%, and the combustion enhancer includes 34 parts of rosin, 9 thixotropic agent, 6 parts of methyl succinic acid, 38 parts of tripropylene glycol butyl ether, 8 parts of benzimidazole and 5 parts of octadecenedioic acid.

[0016] Used with Sn42Bi58 alloy.

[0017] This solder paste based on embodiment one provides a kind of preparation method, comprises the preparation of flux and the mixing of tin powder and flux, and the preparation of described flux comprises the following steps: Step 1, rosin, thixotropic agent, diethylene glycol Add hexyl ether and octadecenedioic acid into the agitator, heat to 130°C and keep it until the material is completely dissolved; step 2, add methyl succinic acid and benzimidazole at 137°C, stir well for 10 minutes, and make the material Dissolve comp...

Embodiment 2

[0019] Embodiment 2, a halogen-free low-temperature environment-friendly solder paste for heat dissipation modules, including tin powder and flux, the proportion of the flux to the tin powder is 10.2%, and the combustion enhancer includes 38 parts of rosin, 7 thixotropic agent, 8 parts of azelaic acid, 32 parts of tripropylene glycol butyl ether, 9 parts of 2-ethylimidazole and 6 parts of octadecenedioic acid.

[0020] This solder paste based on embodiment two provides a kind of preparation method, comprises the preparation of flux and the mixing of tin powder and flux, and the preparation of described flux comprises the following steps: Step 1, rosin, thixotropic agent, diethylene glycol Add hexyl ether and octadecenedioic acid into the stirrer, heat to 138°C and keep it until the material is completely dissolved; step 2, add azelaic acid and 2-ethylimidazole at 136°C, stir well for 10 minutes, and make the material Completely dissolve; step 3, after cooling completely, use a...

Embodiment 3

[0022] Embodiment 3, a halogen-free low-temperature environment-friendly solder paste for heat dissipation modules, including tin powder and flux, the proportion of the flux to the tin powder is 10.8%, and the combustion enhancer includes 41 parts of rosin, 9 thixotropic agent, 5 parts of methyl succinic acid, 30 parts of tripropylene glycol butyl ether, 9 parts of 2-phenylimidazoline and 6 parts of octadecenedioic acid.

[0023] Used with Sn42Bi58 alloy.

[0024] The solder paste based on embodiment three provides a preparation method, including the preparation of flux and the mixing of tin powder and flux, and the preparation of said flux includes the following steps: step 1, rosin, thixotropic agent, diethylene glycol Add hexyl ether and octadecenedioic acid into the stirrer, heat to 136°C and keep it until the materials are completely dissolved; step 2, add methylsuccinic acid and 2-phenylimidazoline at 141°C, and stir well for 10 minutes , so that the material is complet...

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PUM

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Abstract

The invention discloses halogen-free low-temperature environment-friendly soldering paste for a heat dissipation module and a preparing method of the halogen-free low-temperature environment-friendlysoldering paste. Tin powder and scaling powder are included, wherein the proportion of the scaling powder to the tin powder is 9.5%-12%. The scaling powder comprises 30-45 parts of rosin, 6-9 parts ofa thixotropic agent, 5-8 parts of short chain organic acid, 25-40 parts of TPNB, 6-10 parts of imidazole and 5-6 parts of long chain organic acid. The preparing method comprises the steps that the rosin, the thixotropic agent, diethylene glycol hexyl ether and the long chain organic acid are added in a stirrer and heated to be dissolved; the short chain organic acid and the imidazole are added atthe temperature of 135 DEG C-145 DEG C; cooling and solidifying are conducted; sufficient grinding is conducted, and the product and the tin powder are mixed and stirred according to the proportion of 9.5%-12%. The soldering paste is the halogen-free formula, the welding effect is good, and bismuth black cannot occur after welding.

Description

technical field [0001] The invention relates to the technical field of welding materials, in particular to a halogen-free low-temperature environment-friendly solder paste for heat dissipation modules and a preparation method thereof. Background technique [0002] In the 1970s, surface mount technology, referred to as SMT, refers to printing and coating solder paste on the pads of printed circuit boards, and accurately attaching surface mount components to pads coated with solder paste On the one hand, the circuit board is heated according to a specific reflow temperature curve to melt the solder paste, and its alloy components are cooled and solidified to form solder joints between components and printed circuit boards to achieve metallurgical connections. Solder paste is a new type of soldering material that accompanies SMT. Solder paste is a complex system, which is a paste mixed with solder powder, flux and other additives. Solder paste has a certain viscosity at room ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/36B23K35/363B23K35/40
CPCB23K35/3612B23K35/362B23K35/40
Inventor 黄鲁江
Owner 浙江强力控股有限公司