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A kind of LED encapsulation glue and LED lamp bead

A technology of LED packaging and component A, which is applied in the direction of semiconductor devices, electrical components, adhesive additives, etc., can solve problems such as poor high temperature resistance, improve compatibility, improve heat resistance stability, and improve high temperature resistance Effect

Inactive Publication Date: 2021-01-01
SHENZHEN CAPCHEM TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a kind of LED packaging glue for the problem of poor high temperature resistance of the LED packaging glue in the prior art

Method used

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  • A kind of LED encapsulation glue and LED lamp bead
  • A kind of LED encapsulation glue and LED lamp bead

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0017] The preparation method of the above-mentioned heat-resistant additive has no special requirements. For example, it can be as follows: in an anhydrous organic solvent environment, add a metal salt precursor to monohydroxyl silicone oil, then stir the reaction, then wash with water until neutral, and distill under reduced pressure to obtain the obtained The above-mentioned heat-resistant additives.

[0018] As a raw material for the above reaction, the monohydroxy silicone oil is selected from one or more monohydroxy silicone oils with a degree of polymerization of 40-80, a hydroxyl group at one end of the molecular chain, and an alkyl group or an alkenyl group at the other end.

[0019] The terminal hydroxyl group acts as a reactive group to react with the metal salt precursor. The alkyl or alkenyl-containing group at the other end is used as a capping group to avoid negative impact on the performance of the encapsulant.

[0020] Preferably, the monohydroxy silicone oil...

specific example

[0036] As a specific example of the LED encapsulant provided by the present invention, the LED encapsulant includes component A and component B: the component A includes methylvinyl silicone resin A with a viscosity of 400-10000mpa.s Methyl vinyl silicone oil B 1 , Methyl vinyl silicone oil B with a viscosity of 100000-10000mpa.s 2 , heat-resistant additive C as mentioned above; the B component includes methyl vinyl silicone resin A, methyl vinyl silicone oil B with a viscosity of 100000-10000mpa.s 2 . Hydrogen-containing organopolysiloxane D; the weight ratio of component A and component B is 1-10:1.

[0037] The above-mentioned encapsulant provided by the present invention uses a specific amount of methyl vinyl silicone resin and methyl vinyl silicone oil as the basic components, combined with organosiloxane transition metal polymers as heat-resistant additives, which can effectively improve the performance of the encapsulant after curing. High temperature resistance and l...

Embodiment 1

[0055] This example is used to illustrate the heat-resistant additive in the LED encapsulant disclosed in the present invention and its preparation method.

[0056] Add 57g of anhydrous toluene in a three-necked flask equipped with a stirrer, a thermometer, and a condenser, and the 50g structural formula is HO(Me 2 SiO) 40 SiMe 3 7.2 g of cerium isooctanoate solution was added dropwise at 90° C. for 30 min with stirring at 90° C. at a rate of 1 ml / min. After dripping, stirred and reacted for 8 hours, evaporated toluene under reduced pressure, and filtered to obtain a light yellow liquid with a yield of 87%. The content of the cerium element contained in the product is 1055ppm as tested by ICP.

[0057] This product is carried out infrared spectrogram analysis, it can be seen that on the spectrogram 3300cm -1 The nearby hydroxyl peak has disappeared.

[0058] Add this product to LED encapsulant for high temperature test.

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Abstract

The invention provides a packaging adhesive in order to solve the problem of poor high-temperature resistance of an LED (light emitting diode) packaging adhesive in the prior art. The packaging adhesive comprises a heatproof additive C. The heatproof additive C is structurally shown as a formula I namely M((Me2SiO)n1SiMe2R1)m1((Me2SiO)n2SiMe2R2)m2((Me2SiO)n3SiMe2R3)m3((Me2SiO)n4SiMe2R4)m4, whereinR1, R2, R3 and R4 are selected from hydrocarbons independently; n1, n2, n3 and n4 are integers in a range of 40-80 independently; m1, m2, m3 and m4 refer to 0 or 1 independently; M is selected from Fe or Ce, and m1+m2+m3+m4=3; or, M refers to Ti, and m1+m2+m3+m4=4. The LED packaging adhesive is excellent in high-temperature resistance.

Description

technical field [0001] The invention relates to an LED encapsulation glue, in particular to a high-temperature-resistant high-power COB organic silicon encapsulation glue and an LED lamp bead using the encapsulation glue. Background technique [0002] In recent years, LED (Light Emitting Diode, light-emitting diode), as a semiconductor light-emitting device, has been widely used in lighting, backlight, display and other fields due to its advantages such as energy saving, long life, environmental protection, and high light efficiency. With the increasing power density of LED chips, the demand for multi-chip and high-power packaging has further increased, which puts forward higher requirements for the heat dissipation performance of LED packaging solutions. The emergence of new technologies such as high-voltage drive and AC drive has also made the traditional planar electrical interconnection package solution face a dilemma. With more and more applications, more and more deta...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J11/08H01L25/075H01L33/56
CPCC09J11/08H01L25/075H01L33/56
Inventor 赵大成张燕
Owner SHENZHEN CAPCHEM TECH CO LTD