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Circuit board manufacturing method capable of preventing ink spillover

A production method and circuit board technology, which is applied in the fields of printed circuit manufacturing, printed circuit, electrical components, etc., can solve the problems of uneven copper thickness of circuit board expansion and contraction, shortening the process, etc., to optimize the process production process, shorten the process, save The effect of working hours

Inactive Publication Date: 2019-10-15
大连崇达电子有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The purpose of the present invention is to overcome the existing technical defects and provide a circuit board manufacturing method for preventing ink spillage. By optimizing the production process, the method cancels the abrasive belt grinding process and avoids the damage caused by the abrasive belt grinding. Excessive expansion and shrinkage of circuit boards, uneven copper thickness, and under the premise of ensuring the quality of circuit boards, the process is effectively shortened, labor hours are saved and production costs are reduced

Method used

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  • Circuit board manufacturing method capable of preventing ink spillover

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Embodiment

[0030] This embodiment provides a method for manufacturing a circuit board to prevent ink spillage, and the specific process is as follows:

[0031] (1) Cutting: cut out the core board according to the board size 520mm×620mm, the thickness of the core board is 0.8mm, and the thickness of the outer layer of copper foil is 1OZ.

[0032] (2) Inner layer circuit production (negative film process): Inner layer graphics transfer, use a vertical coating machine to coat a photosensitive film on the core board, the film thickness of the photosensitive film is controlled at 8 μm, and a fully automatic exposure machine is used to 5-6 grids The exposure ruler (21-grid exposure ruler) completes the exposure of the inner layer circuit on the core board, and after development, the inner layer circuit pattern is formed on the core board; the inner layer is etched, and the inner layer circuit is etched out of the exposed and developed core board, and the inner layer The line width measurement ...

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PUM

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Abstract

The invention discloses a circuit board manufacturing method capable of preventing ink spillover. The method is characterized by drilling a through hole in a production board after early-stage pressing; then, metalizing the through hole through the copper plating and full-plate electroplating process; carrying out browning processing on the production board; filling the metallized through hole with resin ink; then, sticking away the resin ink protruding out of the board surface through a thin film; and baking the production board to cure the resin ink in the through hole. The method cancels the abrasive belt board grinding process by optimizing the production process, thereby avoiding the problem of large circuit board expansion and shrinkage and uneven copper thickness caused by abrasivebelt board grinding, and on the premise of guaranteeing the quality of the circuit board, effectively shortening the process, saving labor hours and reducing production cost.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to a circuit board production method for preventing ink overflow. Background technique [0002] For the buried holes inside the circuit board, it is generally necessary to perform resin plugging treatment, that is, to fill the buried holes with "resin ink". On the one hand, it plays a role in heat dissipation. The inner layer sub-board becomes a "whole", without the existence of holes, so as to prevent subsequent lamination, causing problems such as board surface depression at the corresponding inner layer buried hole or explosion and delamination caused by gas expansion in the hole. [0003] At present, the general product process for making resin plug holes is as follows: pre-process→pressing→drilling→full plate plating on the inner layer→resin plug hole→curing baking plate→abrasive belt grinding plate→inner layer graphics→browning→pressing→after process....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
CPCH05K3/0088H05K3/0094
Inventor 孙保玉宋建远吴甲林荣孝强刘亚飞
Owner 大连崇达电子有限公司
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