Back passivation solar cell and preparation method thereof
A technology of solar cells and back passivation, which is applied in circuits, photovoltaic power generation, electrical components, etc., and can solve the problems of low photoelectric conversion efficiency of back passivated solar cells
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
preparation example Construction
[0035] refer to figure 1 , the invention provides a kind of preparation method of back passivation solar cell, it comprises the steps:
[0036] S1. Make a passivation film 110 on the back side of the P-type silicon wafer 100, uniformly print some first aluminum pastes containing corrosion aluminum paste on the surface of the passivation film 110, and print the passivation film of some first aluminum pastes. The film 110 is dried.
[0037] Wherein, the main function of the passivation film 110 is to reduce the reflectivity of the surface of the back passivated solar cell, which is more conducive to the utilization of light energy. It can be understood that the material and preparation method of the passivation film 110 are not too limited, and it can be produced by conventional methods and materials for those skilled in the art. For example, the material of the passivation film 110 can be SiN or SiN 2 , the method for forming the passivation film 110 is the PECVD method.
[...
Embodiment 1
[0071] Both the first aluminum paste and the second aluminum paste used in the present invention are purchased from Toyo Aluminum Co., Ltd.
[0072] A preparation method for a back passivated solar cell, comprising the steps of:
[0073] (1) Take the P-type silicon wafer with the SiN film layer grown on the back surface. It can be understood that the P-type silicon wafer is made by sequentially performing conventional steps such as damage removal, texturing, and phosphorus diffusion on the P-type silicon substrate.
[0074] (2) adopt PECVD method to prepare the SiN passivation film of 100nm on the back side of P-type silicon wafer 100, afterwards on the SiN passivation film, use such as image 3 The mask plate 410 shown is used to uniformly print 0.1 g of the first aluminum paste doped with glass powder, and then place it in an oven at 200° C. for drying treatment to obtain an aluminum back field precursor.
[0075] (3) using such as Figure 4 In another mask 420 shown, 0.5 ...
Embodiment 2
[0080] A kind of preparation method of back passivation solar cell, its preparation process is substantially the same as the preparation process of embodiment 1, the difference is that the shape of the mask for printing the first aluminum paste is different, that is, adopt such as Figure 5 A reticle 430 is shown for masking.
PUM
| Property | Measurement | Unit |
|---|---|---|
| Diameter | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 


