Copper piece welding process for power module by using sintered silver paste as bonding agent

A technology for power modules and welding processes, applied in circuits, electrical components, electrical solid devices, etc., can solve the problems of increasing manufacturing costs, natural environment effects, increasing process complexity, etc., to save process time and cost, superior electrical conductivity, Savings on conventional chemical reagents and water cleaning and disposal emissions

Inactive Publication Date: 2019-11-05
山东海声尼克微电子有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, aluminum is an inert metal element, which is mutually exclusive with solder paste (Pb/Sn/Ag), and cannot form a good connection
The usual practice is to electroplate or evaporate one or several layers of other metals (Ni/Pd/Au or Ti/Ni/Ag) on ​​the aluminum pad of the chip, which not only increases the complexity of the process, but also increases the cost of the product
[0004] 2) In the high-temperature lead-tin solder paste, in order to ensure the soldering effect, a certain amount of

Method used

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  • Copper piece welding process for power module by using sintered silver paste as bonding agent
  • Copper piece welding process for power module by using sintered silver paste as bonding agent
  • Copper piece welding process for power module by using sintered silver paste as bonding agent

Examples

Experimental program
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Effect test

specific Embodiment 1

[0039] A power module copper sheet welding process using sintered silver paste as an adhesive, including a copper sheet welding step, in which the sintered silver paste is used as the bonding between the copper sheet and the chip welding area and the frame welding area agent, the welding process includes:

[0040] (a) Die attach film and dicing;

[0041] (b) die attach;

[0042] (c) Dot sintered silver paste: put 3 dots of sintered silver paste on the upper surface of pin 1 and chip 4, the shape of sintered silver paste is hemispherical;

[0043] (d) Copper sheet welding: press the copper sheet welding on the sintered silver paste 3 where the sintered silver paste is placed at point (c), to ensure that the sintered silver paste overflows from the locking hole of the copper sheet,

[0044] (e) Solidification of sintered silver paste: then solidified by reflow soldering, using equipment desktop reflow soldering furnace, which is divided into five stages:

[0045] (1) Heating:...

specific Embodiment 2

[0061] A power module copper sheet welding process using sintered silver paste as an adhesive, including a copper sheet welding step, in which the sintered silver paste is used as the bonding between the copper sheet and the chip welding area and the frame welding area agent, the welding process used for high-current power module bonding includes:

[0062] (a) Die attach film and dicing;

[0063] (b) die attach;

[0064] (c) Spot sintered silver paste: spot the sintered silver paste on the upper surface of pin 1 and chip 4, the shape of the sintered silver paste is hemispherical;

[0065] (d) Copper sheet welding: Press the copper sheet welding on the sintered silver paste at point (c) to ensure that the sintered silver paste overflows from the locking hole of the copper sheet.

[0066] (e) Solidification of sintered silver paste: then solidified by reflow soldering, using equipment desktop reflow soldering furnace:

[0067] (1) Heating: the starting temperature is room tem...

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PUM

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Abstract

The invention discloses a copper piece welding process for a power module by using a sintered silver paste as a bonding agent. The process comprises a copper piece welding step, wherein the sintered silver paste is used as a bonding agent between a copper piece and a chip welding area and a welding frame area. The process has the advantages that the copper piece is connected to a chip aluminum padlayer through the silver paste, the electrical conductivity and electrothermal performance are superior, no chemicals remain after high-temperature curing, the processes of conventional chemical reagents and water cleaning and treatment discharge are saved, and the process time and cost are saved.

Description

technical field [0001] The invention relates to the field of semiconductor packaging, in particular to a power module copper sheet welding process using sintered silver paste as an adhesive in the high-current power module wire bonding technology in the semiconductor packaging technology. Copper sheet soldering process for wire bonding of high current power modules using sintered silver paste as binder. Background technique [0002] Wire bonding is currently one of the most important microelectronic packaging technologies, and more than 90% of chips are currently packaged using this technology. According to different principles, wire bonding can be divided into three methods: thermocompression bonding, ultrasonic bonding and thermocompression ultrasonic bonding; according to the shape of the bonding point, it can be divided into spherical bonding and wedge bonding; in the current power module Among them, the most common interconnection method is the wire bonding method. The...

Claims

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Application Information

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IPC IPC(8): H01L21/60H01L23/492
CPCH01L24/84H01L24/37H01L2224/842H01L2224/4005H01L2224/40245H01L2924/181H01L2224/32245H01L2224/8484H01L2224/8384H01L2924/00012
Inventor 王培洲李睿李广益李鹏军
Owner 山东海声尼克微电子有限公司
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