Method of forming passivation layer, substrate containing passivation layer, and passivation layer removing method
A passivation layer and substrate technology, used in coatings, gaseous chemical plating, metal material coating processes, etc., can solve the problems of uneven thickness, difficult removal of OSP layer, pollution of the substrate, etc., to prevent oxidation and corrosion. Effect
Pending Publication Date: 2019-11-08
SPTS TECH LTD
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Problems solved by technology
Known methods of depositing OSP layers often result in an OSP layer with non-uniform thickness on the substrate surface
Thick and / or uneven OSP layers can be difficult to remove completely, and OSP residue can contaminate the substrate in subsequent processing steps
Method used
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[0055] The present invention relates to a method of preparing a substrate having regions or surfaces of copper, tin, silver or alloys modified with a passivation layer. In particular, the passivation layer of the invention is degradable under high temperature and / or mechanical stress.
[0056] FIG. 1 shows a substrate 100 including a passivation layer formed by the method of the first embodiment. The substrate 100 includes a copper surface 102 modified with a passivation layer 104 . In other embodiments, the substrate may include a tin or silver surface, or an alloy surface comprising one or more of copper, tin, or silver. The copper surface 102 is the exposed surface of the substrate 100 . The copper surface 102 may form part of the exposed area of the substrate 100 . The copper surface 102 may form an integral layer on the surface of the substrate 100 . In some embodiments, substrate 100 is formed entirely of copper.
[0057] Passivation layer 104 includes organic lay...
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Abstract
According to the present invention there is provided a method of forming a passivation layer on a substrate. The method comprises the steps of: a) providing a substrate in a processing chamber, the substrate comprising a metallic surface, wherein the metallic surface is a copper, tin or silver surface, or an alloyed surface comprising one or more of copper, tin or silver; b) depositing at least one organic layer onto the metallic surface by vapor deposition, the organic layer formed from an organic precursor comprising: a first functional group comprising at least one of: oxygen, nitrogen, phosphorus, sulphur, selenium, tellurium, or silicon; and a second functional group selected from hydroxyl (-OH) or carboxyl (COOH);wherein the first functional group is adsorbed onto the metallic surface; and c) depositing at least one inorganic layer onto the organic layer by vapor deposition, wherein the second functional group acts as an attachment site for the inorganic layer. The invention alsorelates to a substrate containing a passivation layer, and a method of removing or degrading the passivation layer from the substrate.
Description
technical field [0001] The invention relates to a method of forming a passivation layer on a substrate. The invention also relates to a substrate comprising a passivation layer formed by the method described above. The invention further relates to a method for removing a passivation layer from a substrate. Background technique [0002] Many metals are prone to oxidation when exposed to or stored in atmospheric conditions. Oxidation of the metal results in the formation of metal oxides on the metal surface. The formation of surface metal oxides adversely affects the chemical, mechanical, optical and electrical properties of the metal. For these reasons, metal oxides are typically removed from metal surfaces prior to forming electrical connections. However, metal oxides can grow beyond the nanometer scale, and their removal is difficult and time-consuming. Therefore, it is desirable to prevent the formation of surface metal oxides. [0003] Known methods for preventing t...
Claims
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Login to View More IPC IPC(8): H01L21/02
CPCH01L21/02263H01L21/02109C23C16/0272C23C16/45525H01L21/02216H01L21/02631H01L21/2855H01L21/02205H01L21/56H01L21/02274H01L21/324B05D1/60C23C16/0254C23C16/40C23C16/4408H05K3/282H05K3/288H05K2203/124
Inventor 米歇尔·格莱姆斯林宇源
Owner SPTS TECH LTD