Adhesive stick glue for thin sliced ​​silicon slices and preparation method thereof

A technology of thinning silicon and sticking rods, applied in the direction of adhesive, adhesive type, epoxy resin glue, etc., can solve the problems of difficult to adapt to the thinning of diamond wire, not easy to reduce production cost, poor water resistance and easy to fall off. , to achieve the effect of shortening curing time, short curing time, degumming temperature and dirt resistance

Active Publication Date: 2021-10-15
广西珀源新材料有限公司
View PDF0 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing adhesives have problems of high degumming temperature (65-75°C), easy contamination of silicon wafers, poor water resistance and easy chipping, unstable degumming, and the existence of existing glues after the cutting base is changed from a resin board to a plastic board. After degumming, the glue wire is easy to fall off and other problems, it is difficult to reduce the production cost, and it is difficult to adapt to the industry trend of thinner diamond wire and thinner silicon wafer

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Adhesive stick glue for thin sliced ​​silicon slices and preparation method thereof
  • Adhesive stick glue for thin sliced ​​silicon slices and preparation method thereof
  • Adhesive stick glue for thin sliced ​​silicon slices and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A kind of adhesive stick glue for thin sliced ​​silicon slices, comprising component A and component B, said component A including glycidyl ester type epoxy resin, bisphenol A epoxy resin, hydrogenated bisphenol A ring Oxygen resin, filler, defoamer, anti-settling agent and coupling agent; said component B includes polythiol, m-xylylenediamine prepolymer, accelerator, filler, defoamer and anti-settling agent ;

[0024] Wherein, the mass ratio of the component A to the component B is 1:1.

[0025] The cutting base used in the silicon wafer slicing industry has switched from resin boards to plastic boards. The degumming of plastic boards is easier than resin boards. The plastic plate falls off, so that the glue filament still sticks to the surface of the silicon wafer, which affects the subsequent production efficiency. Show through statistical result, use the defilament rate of commercially available viscose stick (glue thread falls off from the plastic plate and stick...

Embodiment 2

[0027] A kind of sticky glue that is used for thin slice silicon chip, comprises component A and component B, and component A contains the raw material of following mass fraction: glycidyl ester epoxy resin 5%, bisphenol A type epoxy resin Resin 66.94%, hydrogenated bisphenol A epoxy resin 5%, defoamer 3%, anti-settling agent 0.05-%, coupling agent 0.01%, filler 20%;

[0028] Component B contains the following raw materials in mass fractions: polythiol 50%, m-xylylenediamine prepolymer 5%, accelerator 10%, filler 27%, defoamer 3%, anti-settling agent 5%;

[0029] Wherein, the mass ratio of the component A to the component B is 1:1.

[0030] Show through statistical result, use the defilament rate of commercially available viscose stick (glue thread falls off from the plastic plate and stick on the silicon wafer) ≥ 3%, and use the defilament rate of the viscose stick prepared by the present embodiment ≤0.01%. It can be seen that the glue stick prepared in this example has goo...

Embodiment 3

[0032] A kind of sticky glue that is used for thin slice silicon chip, comprises component A and component B, and component A contains the raw material of following mass fraction: glycidyl ester epoxy resin 5%, bisphenol A type epoxy resin Resin 35%, hydrogenated bisphenol A epoxy resin 5%, silicone defoamer 0.01%, fumed silica 0.05%, KH-550 0.01%, calcium carbonate 54.93%;

[0033] Component B contains the following raw materials in mass fractions: 47% polythiol, 5% m-xylylenediamine prepolymer, 10% accelerator, 30% calcium carbonate, 3% organosilicon defoamer, fumed silica 5%;

[0034] Wherein, the mass ratio of the component A to the component B is 1:1.

[0035] Show through statistical result, use the defilament rate of commercially available viscose stick (glue thread falls off from the plastic plate and stick on the silicon wafer) ≥ 3%, and use the defilament rate of the viscose stick prepared by the present embodiment ≤0.02%. It can be seen that the glue stick prepar...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The present invention provides a kind of adhesive stick glue for thin sliced ​​silicon chip, comprising component A and component B, and said component A comprises glycidyl ester type epoxy resin, bisphenol A epoxy resin, hydrogenated bisphenol A Phenol A epoxy resin, filler, defoamer, anti-settling agent and coupling agent; Described component B comprises polymercaptan, m-xylylenediamine prepolymer, accelerator, filler, defoamer and Anti-sedimentation agent; Wherein, the mass ratio of described component A and described component B is 1:1-1.2. The invention also provides a preparation method of the stick glue. The invention has the characteristics of short curing time, low degumming temperature, dirt resistance and the like.

Description

technical field [0001] The invention relates to stick glue. More specifically, the present invention relates to a kind of sticky glue for thin slice silicon chip and its preparation method. Background technique [0002] Silicon wafers for solar cells need to use adhesive glue in the cutting process. However, with the improvement of the cutting process from sand wire cutting to diamond wire cutting, the thickness of the cut silicon wafers is thinner, the cutting speed is faster, and the utilization rate of raw materials is higher. . However, the existing adhesives have problems of high degumming temperature (65-75°C), easy contamination of silicon wafers, poor water resistance and easy chipping, unstable degumming, and the existence of existing glues after the cutting base is changed from a resin board to a plastic board. After degumming, the rubber filaments are easy to fall off and other problems, it is difficult to reduce production costs, and it is difficult to adapt to...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J11/04C08G59/66C08G59/56
CPCC08G59/56C08G59/66C08K2003/265C08K2003/3045C08L2205/025C09J11/04C09J163/00C08L63/00C08K3/26C08K3/34
Inventor 黄世文吴世炆苏光临陈韬
Owner 广西珀源新材料有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap