High-frequency high-speed and high-density circuit board manufacturing process

Abstract

The invention belongs to the technical field of manufacturing processes, and particularly relates to a high-frequency high-speed and high-density circuit board manufacturing process. The high-frequency high-speed and high-density circuit board manufacturing process comprises the following steps of S1, selecting a double-sided copper plate, cutting the double-sided copper plate into workpieces withdifferent sizes according to production requirements, and selecting a set workpiece size according to the sizes so as to avoid wastes and the increased unnecessary cost; S2, processing the copper foil; and forming a fine concave-convex surface on the copper foil through the oxidation treatment of the copper foil and before the synthetization of the outer layer. According to the high-frequency high-speed and high-density circuit board manufacturing process, the combination mode of a lining plate and a lining frame is adopted in the manufacturing of the circuit board. The lining plate is used for mounting the bottom and the top of the circuit board. Through the cooperation of the lining frame, the circulation speed of the airflow is improved through the generation of gaps. Meanwhile, the heat of the lining plate is guided. An arc plate with arc plate holes is utilized, so that the heat dissipation speed is increased. The use purpose of the high-frequency, high-speed and high-density circuit board is achieved. The stability of the circuit board is improved under the condition of no external energy consumption.

Description

technical field [0001] The invention relates to the technical field of manufacturing technology, in particular to a high-frequency, high-speed, high-density circuit board manufacturing technology. Background technique [0002] Circuit boards are divided into three categories: single-panel, double-panel, and multi-layer circuit boards according to the number of layers. The circuit board makes the circuit miniaturized and intuitive, and is suitable for mass production of fixed circuits and optimized electrical layout. makes an important impact. [0003] With the miniaturization and digitization of electronic products, printed circuit boards are also developing towards high density and high precision. [0004] In some high-frequency and high-speed environments, how to ensure the stability and life of the circuit board has always been one of the topics of discussion and research. Under the high-frequency, high-speed and high-density use requirements of the existing circuit boar...

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Problems solved by technology

[0005] The purpose of the present invention is to provide a high-frequency, high-speed, high-density circuit board manufacturing process to solve the problem that the existing circuit boards proposed in the above background technology will accumulate heat under the requirements of high-frequency, high-speed, and high-density use, which cannot be effectively processed. The rapid heat dissipation of the circuit board affects the accuracy and life of the circuit board. It needs to cooperate with the external heat dissipation device, which results in the consumption of external energy. In the external heat dissipation process of the circuit board in the face of large volume, large range and special environment In the process, it will cause huge waste of external energy and difficult disadvantages

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