High-frequency high-speed and high-density circuit board manufacturing process
A circuit board manufacturing, high-density technology, applied in the direction of printed circuit manufacturing, printed circuit, printed circuit, etc., can solve the problems of external energy consumption, difficulty, external energy waste, etc., to improve the air circulation speed and improve the stability of use , Increase the effect of cooling speed
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[0042] Example
[0043] S1: Select the double-sided copper plate 100 to be cut into different sizes of workpieces according to the production needs, and choose the established workpiece size according to the size to avoid waste and increase unnecessary costs;
[0044] S2: Process the copper foil 120. Before being combined with the outer layer, the copper foil 120 must be oxidized to form a fine uneven surface, and the oxidation treatment time is 35 minutes;
[0045] S3: Paste the photosensitive dry film on the double-sided copper plate 100 as the inner layer, and then close the film used to make the inner layer wiring, expose, and then perform the development process, leaving only the wiring required Where, by etching, remove the unnecessary copper foil 120;
[0046] S4: The double-sided copper plate 100 after oxidation treatment, the outer layer copper plate 110 is combined with the outer layer 110, in a vacuum state, while heating, while being compressed by a laminator, the pressure...
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